Lead-Free Flip Chip On Board Assembly

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Journal Title
Journal ISSN
Volume Title
Helsinki University of Technology | Diplomityö
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Date
2000
Major/Subject
Elektroniikan valmistustekniikka
Mcode
S-113
Degree programme
Language
en
Pages
98 s. + liitt. 2
Series
Description
Supervisor
Kivilahti, Jorma
Thesis advisor
Kujala, Kauppi
Keywords
flip chip, Sn/Ag/Cu, lead-free, lyijyttömyys, reliability, luotettavuus, electronics packaging, elektroniikan pakkaus, cellular phone, matkapuhelin
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Citation