Process Integration of Low-Temperature Wafer-Level Microsystem Vacuum Packaging
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URL
Journal Title
Journal ISSN
Volume Title
Sähkötekniikan korkeakoulu |
Master's thesis
Authors
Date
2023-08-21
Department
Major/Subject
Smart Systems Integrated Solutions
Mcode
ELEC3064
Degree programme
Master’s Programme in Smart Systems Integrated Solutions (Erasmus Mundus)
Language
en
Pages
76
Series
Description
Supervisor
Vuorinen, VesaThesis advisor
Golim, ObertKeywords
solid liquid interdiffusion bonding, process integration, wafer level packaging, intermetallic compounds, hermeticity