Optimization of two-level deep reactive ion etching process

School of Chemical Engineering | Master's thesis

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Instructions for the author

2010

Elektroniikan valmistustekniikka

S-113

fi

viii + 84 + [9]

Paulasto-Kröckel, Mervi

Savolainen, Kari

DRIE, DRIE, 2-level masking, tuplamaskaus, Si residual, piijäämä, Bosch process, Bosch-prosessi