Automation of wire bond destructive testing

dc.contributorAalto-yliopistofi
dc.contributorAalto Universityen
dc.contributor.advisorValdez, Sherwille
dc.contributor.authorRiento, Lauri
dc.contributor.schoolSähkötekniikan korkeakoulufi
dc.contributor.supervisorPaulasto-Kröckel, Mervi
dc.date.accessioned2021-06-20T17:15:24Z
dc.date.available2021-06-20T17:15:24Z
dc.date.issued2021-06-14
dc.format.extent99+8
dc.identifier.urihttps://aaltodoc.aalto.fi/handle/123456789/108306
dc.identifier.urnURN:NBN:fi:aalto-202106207564
dc.language.isoenen
dc.locationP1fi
dc.programmeAEE - Master’s Programme in Automation and Electrical Engineering (TS2013)fi
dc.programme.majorTranslational Engineeringfi
dc.programme.mcodeELEC3023fi
dc.subject.keywordwire bondingen
dc.subject.keyworddestructive testingen
dc.subject.keywordMSAen
dc.subject.keywordGage R&Ren
dc.subject.keywordMIL-STD-883en
dc.subject.keywordAEC-Q100-001en
dc.titleAutomation of wire bond destructive testingen
dc.titleLankaliittämisen tuhoavan testauksen automatisointifi
dc.typeG2 Pro gradu, diplomityöfi
dc.type.ontasotMaster's thesisen
dc.type.ontasotDiplomityöfi
local.aalto.electroniconlyyes
local.aalto.openaccessno

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