Automation of wire bond destructive testing
dc.contributor | Aalto-yliopisto | fi |
dc.contributor | Aalto University | en |
dc.contributor.advisor | Valdez, Sherwille | |
dc.contributor.author | Riento, Lauri | |
dc.contributor.school | Sähkötekniikan korkeakoulu | fi |
dc.contributor.supervisor | Paulasto-Kröckel, Mervi | |
dc.date.accessioned | 2021-06-20T17:15:24Z | |
dc.date.available | 2021-06-20T17:15:24Z | |
dc.date.issued | 2021-06-14 | |
dc.format.extent | 99+8 | |
dc.identifier.uri | https://aaltodoc.aalto.fi/handle/123456789/108306 | |
dc.identifier.urn | URN:NBN:fi:aalto-202106207564 | |
dc.language.iso | en | en |
dc.location | P1 | fi |
dc.programme | AEE - Master’s Programme in Automation and Electrical Engineering (TS2013) | fi |
dc.programme.major | Translational Engineering | fi |
dc.programme.mcode | ELEC3023 | fi |
dc.subject.keyword | wire bonding | en |
dc.subject.keyword | destructive testing | en |
dc.subject.keyword | MSA | en |
dc.subject.keyword | Gage R&R | en |
dc.subject.keyword | MIL-STD-883 | en |
dc.subject.keyword | AEC-Q100-001 | en |
dc.title | Automation of wire bond destructive testing | en |
dc.title | Lankaliittämisen tuhoavan testauksen automatisointi | fi |
dc.type | G2 Pro gradu, diplomityö | fi |
dc.type.ontasot | Master's thesis | en |
dc.type.ontasot | Diplomityö | fi |
local.aalto.electroniconly | yes | |
local.aalto.openaccess | no |