Automation of wire bond destructive testing
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URL
Journal Title
Journal ISSN
Volume Title
Sähkötekniikan korkeakoulu |
Master's thesis
Authors
Date
2021-06-14
Department
Major/Subject
Translational Engineering
Mcode
ELEC3023
Degree programme
AEE - Master’s Programme in Automation and Electrical Engineering (TS2013)
Language
en
Pages
99+8
Series
Description
Supervisor
Paulasto-Kröckel, MerviThesis advisor
Valdez, SherwilleKeywords
wire bonding, destructive testing, MSA, Gage R&R, MIL-STD-883, AEC-Q100-001