Failure Analysis of Flip Chips in a Laminate Based MCM
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Helsinki University of Technology |
Master's thesis
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P1 Ark TKK
P1 Ark TKK
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Mcode
S-113
Degree programme
Language
en
Pages
118
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Description
Supervisor
Kivilahti, JormaThesis advisor
Stenberg, TuulaKeywords
flip chip, kääntösirutekniikka, failure analysis, vaurioanalyysi, Bluetooth, Bluetooth, reliability, luotettavuus, drop test, pudotustesti, thermal cyclling, lämpösyklaus, edge fillet, alustäyte, underfill, reunatäyte, void, delaminaatio, delamination, piisirun halkeaminen, die crack, juoteliitoksen väsyminen, solder fatigue