Acoustics simulation in mobile phone audio design
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Helsinki University of Technology |
Diplomityö
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Instructions for the author
Authors
Date
1999
Department
Major/Subject
Akustiikka ja äänenkäsittelytekniikka
Mcode
S-89
Degree programme
Language
en
Pages
103
Series
Description
Supervisor
Karjalainen, MattiThesis advisor
Backman, JuhaKeywords
simulation, modelling, leak tolerance, earpiece, simulointi, mallinnus, vuotosietoisuus, kuuloke