The Effects of Additives on the Electrodeposition of Copper Studied by Impedance Technigue
No Thumbnail Available
URL
Journal Title
Journal ISSN
Volume Title
Helsinki University of Technology |
Licentiate thesis
Checking the digitized thesis and permission for publishing
Instructions for the author
Instructions for the author
Authors
Date
1984
Department
Major/Subject
Fysikaalinen kemia
Mcode
5.31
Degree programme
Language
en
Pages
44 s. + liitt. 35