Thermal Conductivity of Solidified Industrial Copper Matte and Fayalite Slag

Loading...
Thumbnail Image

Access rights

openAccess
acceptedVersion

URL

Journal Title

Journal ISSN

Volume Title

A1 Alkuperäisartikkeli tieteellisessä aikakauslehdessä

Major/Subject

Mcode

Degree programme

Language

en

Pages

8

Series

JOM, Volume 72, issue 5, pp. 1927–1934

Abstract

The thermal conductivity of various copper matte and fayalite slag was measured using laser flash analysis, a non-steady state measurement method. Industrial matte and slag samples were taken in such a way that their composition represented typical process conditions. Thermal conductivities for solid copper matte (average 64% Cu) were found to be from 1.2 W m−1 K−1 at 300°C to 2.1 W m−1 K−1 at 900°C. Because arsenic is one of the most important impurities in copper matte, its effect on thermal conductivity was investigated with As-doped matte samples up to 0.59% As. The results showed substantially lower thermal conductivity, between 0.5 W m−1 K−1 and 1.3 W m−1 K−1 at 300–900°C with low As matte, behavior that is analogous to that of a semiconductor. The data obtained showed that the thermal conductivity of copper matte increased linearly with temperature, but the gradient was small. The thermal conductivity of slags was found to be between 1.6 W m−1 K−1 and 1.9 W m−1 K−1, values that are consistent with earlier studies.

Description

Keywords

Other note

Citation

Sibarani, D, Hamuyuni, J, Luomala, M, Lindgren, M & Jokilaakso, A 2020, 'Thermal Conductivity of Solidified Industrial Copper Matte and Fayalite Slag', JOM, vol. 72, no. 5, pp. 1927–1934. https://doi.org/10.1007/s11837-020-04072-0