Temperature Stability of Electrode/AlScN Multilayer Systems for pMUT Process Integration

dc.contributorAalto-yliopistofi
dc.contributorAalto Universityen
dc.contributor.authorBespalova, Kristinaen_US
dc.contributor.authorRoss, Glennen_US
dc.contributor.authorPaulasto-Kröckel, Mervien_US
dc.contributor.authorThanniyil, Abhilash Sebastianen_US
dc.contributor.authorKaruthedath, Cyrilen_US
dc.contributor.authorMertin, Stefanen_US
dc.contributor.authorPensala, Tuomasen_US
dc.contributor.departmentDepartment of Electrical Engineering and Automationen
dc.contributor.groupauthorElectronics Integration and Reliabilityen
dc.contributor.organizationVTT Technical Research Centre of Finlanden_US
dc.date.accessioned2021-01-25T10:12:09Z
dc.date.available2021-01-25T10:12:09Z
dc.date.issued2020-09-07en_US
dc.description| openaire: EC/H2020/783132/EU//POSITION-II
dc.description.abstractIn this study, Al0.8Sc0.2N multilayer structures phase stability, interfacial quality, and piezoelectric response were tested before and after annealing in wide range of temperatures and times. The thicknesses and sequence of the layers in the structures are a replica of the design used for the fabrication of piezoelectric micromachined ultrasonic transducers (pMUTs). Al, AlSi (1%), Al/Mo, and Mo have been assessed to choose the most reliable top electrode (TE) material for the structures. The piezoresponse of the structure was estimated by measuring the deflection of piezocantilevers as a function of voltage applied over the film. Membrane deflection at resonance frequency for AlScN- and AlN-based pMUTs was simulated in COMSOL Multiphysics. It is found that the structure with Mo TE layer is stable after annealing at 800°C for 300 h and at 1000 °C for 100 h. None of the structures formed any phases at the interface between the electrode layer and AlScN. Membrane deflection for structures with AlScN as piezolayer is almost three times higher as compared to structures with AlN as piezolayer. Moreover, the pMUT membrane deflection increases after annealing of the structure.en
dc.description.versionPeer revieweden
dc.format.extent4
dc.identifier.citationBespalova, K, Ross, G, Paulasto-Kröckel, M, Thanniyil, A S, Karuthedath, C, Mertin, S & Pensala, T 2020, Temperature Stability of Electrode/AlScN Multilayer Systems for pMUT Process Integration. in Proceedings of the IEEE International Ultrasonics Symposium, IUS 2020., 9251496, IEEE International Ultrasonics Symposium, IEEE, IEEE International Ultrasonics Symposium, Las Vegas, Nevada, United States, 07/09/2020. https://doi.org/10.1109/IUS46767.2020.9251496en
dc.identifier.doi10.1109/IUS46767.2020.9251496en_US
dc.identifier.isbn9781728154480
dc.identifier.issn1948-5719
dc.identifier.issn1948-5727
dc.identifier.otherPURE UUID: 57a257d7-bb3c-47bc-829e-e417944f9d52en_US
dc.identifier.otherPURE ITEMURL: https://research.aalto.fi/en/publications/57a257d7-bb3c-47bc-829e-e417944f9d52en_US
dc.identifier.urihttps://aaltodoc.aalto.fi/handle/123456789/102155
dc.identifier.urnURN:NBN:fi:aalto-202101251465
dc.language.isoenen
dc.relationinfo:eu-repo/grantAgreement/EC/H2020/783132/EU//POSITION-IIen_US
dc.relation.fundinginfoACKNOWLEDGMENT This work is part of the POSITION-II project funded by the ECSEL Joint Undertaking under grant number Ecsel-783132-Position-II-2017-IA (www.position-2.eu). Ms. Bespalova appreciates the funding from Aalto ELEC Doctoral School. M.Sc. Elmeri Österlund is acknowledged for his help with piezocantilever fabrication and XRD measurements.
dc.relation.ispartofIEEE International Ultrasonics Symposiumen
dc.relation.ispartofseriesProceedings of the IEEE International Ultrasonics Symposium, IUS 2020en
dc.relation.ispartofseriesIEEE International Ultrasonics Symposiumen
dc.rightsrestrictedAccessen
dc.subject.keywordAluminium Scandium Nitrideen_US
dc.subject.keywordAnnealingen_US
dc.subject.keywordPMUTen_US
dc.subject.keywordThin-film depositionen_US
dc.titleTemperature Stability of Electrode/AlScN Multilayer Systems for pMUT Process Integrationen
dc.typeA4 Artikkeli konferenssijulkaisussafi

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