A temperature and process compensation circuit for resistive-based in-memory computing arrays

dc.contributorAalto-yliopistofi
dc.contributorAalto Universityen
dc.contributor.authorMonga, Dipesh C.en_US
dc.contributor.authorNuman, Omaren_US
dc.contributor.authorAndraud, Martinen_US
dc.contributor.authorHalonen, Karien_US
dc.contributor.departmentDepartment of Electronics and Nanoengineeringen
dc.contributor.groupauthorKari Halonen Groupen
dc.contributor.groupauthorMartin Andraud Groupen
dc.contributor.organizationDepartment of Electronics and Nanoengineeringen_US
dc.date.accessioned2023-08-30T04:21:46Z
dc.date.available2023-08-30T04:21:46Z
dc.date.issued2023en_US
dc.descriptionFunding Information: ACKNOWLEDGMENTS This work is supported by Academy of Finland projects EHIR (grant 13334487) and WHISTLE (grant 332218) Publisher Copyright: © 2023 IEEE.
dc.description.abstractIn-Memory Computing (IMC) architectures promise increased energy-efficiency for embedded artificial intelligence. Many IMC circuits rely on analog computation, which is more sensitive to process and temperature variations than digital. Thus, maintaining a suitable computation accuracy may require process and temperature compensation. Focusing on resistive-based IMC architectures, we propose an ultra-low power circuit to compensate for the temperature and process-based non-linearities of resistive computing elements. The proposed circuit, implemented in 65 nm CMOS can provide a temperature coefficient between 10 and 1938 ppm/°C for a wide temperature range (-40°C to 80°C) and output current range (few pA up to 600 nA) at 1.2 V operating voltage. Used in a resistive IMC array, the variation of output currents from each multiply-accumulate (MAC) operation can be reduced by up to 84% to maintain computation accuracy across process and temperature variations.en
dc.description.versionPeer revieweden
dc.format.mimetypeapplication/pdfen_US
dc.identifier.citationMonga, D C, Numan, O, Andraud, M & Halonen, K 2023, A temperature and process compensation circuit for resistive-based in-memory computing arrays. in ISCAS 2023 - 56th IEEE International Symposium on Circuits and Systems, Proceedings. IEEE International Symposium on Circuits and Systems proceedings, vol. 2023-May, IEEE, IEEE International Symposium on Circuits and Systems, Monterey, California, United States, 21/05/2023. https://doi.org/10.1109/ISCAS46773.2023.10181619en
dc.identifier.doi10.1109/ISCAS46773.2023.10181619en_US
dc.identifier.isbn978-1-6654-5110-9
dc.identifier.isbn978-1-6654-5109-3
dc.identifier.issn0271-4310
dc.identifier.issn2158-1525
dc.identifier.otherPURE UUID: aee74d2a-966e-4b84-aa16-a3ea1de71a6den_US
dc.identifier.otherPURE ITEMURL: https://research.aalto.fi/en/publications/aee74d2a-966e-4b84-aa16-a3ea1de71a6den_US
dc.identifier.otherPURE FILEURL: https://research.aalto.fi/files/119791375/Monga_Temperature_and_process_compensation_RSENSE.pdf
dc.identifier.urihttps://aaltodoc.aalto.fi/handle/123456789/122997
dc.identifier.urnURN:NBN:fi:aalto-202308305337
dc.language.isoenen
dc.relation.fundinginfoACKNOWLEDGMENTS This work is supported by Academy of Finland projects EHIR (grant 13334487) and WHISTLE (grant 332218)
dc.relation.ispartofIEEE International Symposium on Circuits and Systemsen
dc.relation.ispartofseriesISCAS 2023 - 56th IEEE International Symposium on Circuits and Systems, Proceedingsen
dc.relation.ispartofseriesIEEE International Symposium on Circuits and Systems proceedings ; Volume 2023-Mayen
dc.rightsopenAccessen
dc.subject.keywordIn-memory computingen_US
dc.subject.keywordprocess compensationen_US
dc.subject.keywordResistive random access memoryen_US
dc.subject.keywordThermal compensationen_US
dc.subject.keywordultra-low poweren_US
dc.subject.keywordvariable temperature coefficienten_US
dc.titleA temperature and process compensation circuit for resistive-based in-memory computing arraysen
dc.typeA4 Artikkeli konferenssijulkaisussafi
dc.type.versionacceptedVersion

Files