A temperature and process compensation circuit for resistive-based in-memory computing arrays
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A4 Artikkeli konferenssijulkaisussa
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Date
2023
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Language
en
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ISCAS 2023 - 56th IEEE International Symposium on Circuits and Systems, Proceedings, IEEE International Symposium on Circuits and Systems proceedings, Volume 2023-May
Abstract
In-Memory Computing (IMC) architectures promise increased energy-efficiency for embedded artificial intelligence. Many IMC circuits rely on analog computation, which is more sensitive to process and temperature variations than digital. Thus, maintaining a suitable computation accuracy may require process and temperature compensation. Focusing on resistive-based IMC architectures, we propose an ultra-low power circuit to compensate for the temperature and process-based non-linearities of resistive computing elements. The proposed circuit, implemented in 65 nm CMOS can provide a temperature coefficient between 10 and 1938 ppm/°C for a wide temperature range (-40°C to 80°C) and output current range (few pA up to 600 nA) at 1.2 V operating voltage. Used in a resistive IMC array, the variation of output currents from each multiply-accumulate (MAC) operation can be reduced by up to 84% to maintain computation accuracy across process and temperature variations.Description
Funding Information: ACKNOWLEDGMENTS This work is supported by Academy of Finland projects EHIR (grant 13334487) and WHISTLE (grant 332218) Publisher Copyright: © 2023 IEEE.
Keywords
In-memory computing, process compensation, Resistive random access memory, Thermal compensation, ultra-low power, variable temperature coefficient
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Citation
Monga, D C, Numan, O, Andraud, M & Halonen, K 2023, A temperature and process compensation circuit for resistive-based in-memory computing arrays . in ISCAS 2023 - 56th IEEE International Symposium on Circuits and Systems, Proceedings . IEEE International Symposium on Circuits and Systems proceedings, vol. 2023-May, IEEE, IEEE International Symposium on Circuits and Systems, Monterey, California, United States, 21/05/2023 . https://doi.org/10.1109/ISCAS46773.2023.10181619