Interfacial compatibility of polymer-based structures in electronics
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Doctoral thesis (article-based)
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Date
2004-10-01
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Language
en
Pages
51, [112]
Series
Report series / Helsinki University of Technology, Laboratory of Electronics Production Technology, 11
Abstract
Interfacial compatibility of dissimilar materials was investigated to achieve a better understanding of interfacial adhesion in metal/polymer/metal systems. Surface modifications of polymers were applied to improve the adhesion. The modified surfaces were characterised by scanning electron microscopy (SEM), atomic force microscopy (AFM), X-ray photoelectron spectroscopy (XPS) and contact angle measurements accompanied by surface free energy evaluations. The pull-off test was employed to assess the interfacial adhesion strength. Further, to determine the controlling adhesion mechanism, the fracture surfaces exposed in the pull-off test were examined by microscopy. To achieve modification of certain bulk properties of one of the evaluated polymers (SU8 epoxy resin), new star-shaped oligomers were synthesised and reactively blended with it. Oligomers were characterised by 1H and 13C nuclear magnetic resonance (NMR) spectroscopy, Fourier transform infrared (FTIR) spectroscopy, size exclusion chromatography (SEC) and differential scanning calorimetry (DSC). Films of the blends were spin coated on a silicon wafer for characterisation of the refractive index and a novel non-destructive method was developed to measure selected thermal properties of the films. The information concerning interfacial compatibility obtained in this work is of great practical as well as theoretical importance.Description
Keywords
interfacial compatibility, adhesion, characterisation, electronics, surfaces, polycaprolactone, crosslinking
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Parts
- Additional errata file available.
- Turunen Markus P. K., Laurila Tomi and Kivilahti Jorma K., 2002. Evaluation of the surface free energy of spin-coated photodefinable epoxy. Journal of Polymer Science Part B: Polymer Physics 40, number 18, pages 2137-2149. [article1.pdf] © 2002 John Wiley & Sons, Inc. By permission.
- Turunen Markus P. K., Marjamäki Pekka, Paajanen Matti, Lahtinen Jouko and Kivilahti Jorma K., 2004. Pull-off test in the assessment of adhesion at printed wiring board metallisation/epoxy interface. Microelectronics Reliability 44, number 6, pages 993-1007. [article2.pdf] © 2004 Elsevier Science. By permission.
- Ge Jun, Turunen Markus P. K. and Kivilahti Jorma K., 2003. Surface modification and characterization of photodefinable epoxy/copper systems. Thin Solid Films 440, numbers 1-2, pages 198-207. [article3.pdf] © 2003 Elsevier Science. By permission.
- Ge Jun, Turunen Markus P. K., Kusevic Maja and Kivilahti Jorma K., 2003. Effects of surface treatment on the adhesion of copper to a hybrid polymer material. Journal of Materials Research 18, number 11, pages 2697-2707. [article4.pdf] © 2003 Materials Research Society. By permission.
- Ge Jun, Turunen Markus P. K. and Kivilahti Jorma K., 2003. Surface modification of a liquid-crystalline polymer for copper metallization. Journal of Polymer Science Part B: Polymer Physics 41, number 6, pages 623-636. [article5.pdf] © 2003 John Wiley & Sons, Inc. By permission.
- Turunen Markus P. K., Korhonen Harri, Tuominen Jukka and Seppälä Jukka V., 2002. Synthesis, characterization and crosslinking of functional star-shaped poly(ε-caprolactone). Polymer International 51, number 1, pages 92-100. [article6.pdf] © 2002 Society of Chemical Industry, John Wiley & Sons, Inc. By permission.
- Turunen Markus P. K., Laurila Tomi, Solehmainen Kimmo and Kivilahti Jorma K., 2004. Reactive blending approach to modify spin coated epoxy film. Helsinki University of Technology, Laboratory of Electronics Production Technology, Report 10 (HUT-EPT-10), 42 pages. [article7.pdf] © 2004 by authors.