Pb-Free Die-Attach Materials for Electronic Power Packages

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Journal Title

Journal ISSN

Volume Title

Helsinki University of Technology | Master's thesis
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Authors

Date

2003

Department

Materiaali- ja kalliotekniikan osasto

Major/Subject

Elektroniikan valmistustekniikka

Mcode

S-113

Degree programme

Language

en

Pages

106

Series

Description

Supervisor

Kivilahti, Jorma

Thesis advisor

Paulasto-Kröckel, Mervi

Keywords

Die-attach, puolijohdesirun kiinnitys, Pb-free temperature solder, lyijytön, conductive adhesive, korkealämpötilajuote, johtava liima

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Citation

Permanent link to this item

https://urn.fi/URN:NBN:fi:aalto-2020120450211

Collections

[dipl] Teknillinen korkeakoulu / TKK