Pb-Free Die-Attach Materials for Electronic Power Packages
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Helsinki University of Technology |
Diplomityö
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Instructions for the author
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Date
2003
Department
Major/Subject
Elektroniikan valmistustekniikka
Mcode
S-113
Degree programme
Language
en
Pages
106
Series
Description
Supervisor
Kivilahti, JormaThesis advisor
Paulasto-Kröckel, MerviKeywords
Die-attach, puolijohdesirun kiinnitys, Pb-free temperature solder, lyijytön, conductive adhesive, korkealämpötilajuote, johtava liima