Fixed Abrasive Chemical Mechanical Planarization Process Development for MEMS-Applications
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Helsinki University of Technology |
Diplomityö
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Instructions for the author
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Date
2009
Department
Major/Subject
Metalli- ja materiaalioppi
Mcode
Mak-45
Degree programme
Language
en
Pages
128 + 33
Series
Description
Supervisor
Hannula, Simo-PekkaThesis advisor
Kilpinen, PetteriHaimi, Eero
Keywords
CMP, CMP, chemical mechanical planarization, planarisointi, chemical mechanical polishing, kemiallis mekaaninen kiillotus, FA, MEMS, fixed abrasive, mikroelektromekaaniset systeemit, MEMS, mikrosysteemit, microelectromechanical systems, pii, microsystems, piidioksidi, silicon, boorisilikaattilasi, silicon dioxide, BF33, alkali borosilicate glass, BF33