Box Integration and Boundary Element: Methods for Modeling Substrate Coupling in Integrated Circuits
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Journal Title
Journal ISSN
Volume Title
Helsinki University of Technology |
Licentiate thesis
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Instructions for the author
Instructions for the author
Author
Date
2001
Department
Major/Subject
Teoreettinen sähkötekniikka
Mcode
S-55
Degree programme
Language
en
Pages
vi + 49 s. + liitt.
Series
Description
Supervisor
Valtonen, MarttiThesis advisor
Heleskivi, JouniKeywords
substrate coupling, interconnect modeling, integrated circuits, substrate noise, cross-talk, Box Integration Method, Boundary Element Method
