Electronic cooling of a submicron-sized metallic beam
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© 2009 American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior permission of the author and the American Institute of Physics. The following article appeared in Applied Physics Letters and may be found at http://scitation.aip.org/content/aip/journal/apl/94/7/10.1063/1.3080668
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School of Science |
A1 Alkuperäisartikkeli tieteellisessä aikakauslehdessä
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Date
2009
Major/Subject
Mcode
Degree programme
Language
en
Pages
073101/1-3
Series
Applied Physics Letters, Volume 94, Issue 7
Abstract
We demonstrate electronic cooling of a suspended AuPd island using superconductor-insulator-normal metaltunnel junctions. This was achieved by developing a simple fabrication method for reliably releasing narrow submicron-sized metal beams. The process is based on reactive ion etching and uses a conducting substrate to avoid charge-up damage and is compatible with, e.g., conventional e-beam lithography, shadow-angle metal deposition, and oxide tunnel junctions. The devices function well and exhibit clear cooling, up to a factor of 2 at sub-Kelvin temperatures.Description
Keywords
phonons, superconducting metals, tunnel junctions, etching, microelectromechanical systems
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Citation
Muhonen, J. T. & Niskanen, A. O. & Meschke, M. & Pashkin, Yu. A. & Tsai, J. S. & Sainiemi, L. & Franssila, S. & Pekola, Jukka. 2009. Electronic cooling of a submicron-sized metallic beam. Applied Physics Letters. Volume 94, Issue 7. P. 073101/1-3. ISSN 0003-6951 (printed). DOI: 10.1063/1.3080668.