A Universal Pick-and-Place Assembly for Nanowires

dc.contributorAalto Universityen
dc.contributor.authorAli, Utku Emreen_US
dc.contributor.authorYang, Heen_US
dc.contributor.authorKhayrudinov, Vladislaven_US
dc.contributor.authorModi, Gauraven_US
dc.contributor.authorCheng, Zengguangen_US
dc.contributor.authorAgarwal, Riteshen_US
dc.contributor.authorLipsanen, Harrien_US
dc.contributor.authorBhaskaran, Harishen_US
dc.contributor.departmentDepartment of Electronics and Nanoengineeringen
dc.contributor.groupauthorHarri Lipsanen Groupen
dc.contributor.organizationUniversity of Oxforden_US
dc.contributor.organizationBeihang Universityen_US
dc.contributor.organizationUniversity of Pennsylvaniaen_US
dc.descriptionFunding Information: The authors thank Nathan Youngblood, Benjamin F. Porter, Jia Hao Eugene Soh, and A.Ne for their valuable inputs during discussions. V.K. acknowledges the support of Aalto University Doctoral School, Walter Ahlström Foundation, Elektroniikkainsinöörien Säätiö, Sähköinsinööriliiton Säätiö, Nokia Foundation, Finnish Foundation for Technology Promotion (Tekniikan Edistämissäätiö), Waldemar von Frenckell's foundation and Kansallis‐Osake‐Pankki fund, and the EU H2020‐MSCA‐RISE‐872049 (IPN‐Bio). V.K. and H.L. acknowledge financial support from Academy of Finland Flagship Programme (320167, PREIN) and the technical support by Aalto University at Micronova Nanofabrication Centre. R.A. and G.M. were supported by the ONR‐MURI, grant #N00014‐17‐1‐2661. UEA was supported by The Scientific and Technological Research Council of Turkey (TÜBİTAK) and the Department of Materials, University of Oxford. H.B. acknowledges long‐term support from EPSRC (grants EP/J00541X/2, EP/M015173/1, EP/T023899/1, EP/J018694/1, and EP/R001677/1). Publisher Copyright: © 2022 The Authors. Small published by Wiley-VCH GmbH.
dc.description.abstractWith the introduction of techniques to grow highly functional nanowires of exotic materials and demonstrations of their potential in new applications, techniques for depositing nanowires on functional platforms have been an area of active interest. However, difficulties in handling individual nanowires with high accuracy and reliability have so far been a limiting factor in large-scale integration of high-quality nanowires. Here, a technique is demonstrated to transfer single nanowires reliably on virtually any platform, under ambient conditions. Functional nanowires of InP, AlGaAs, and GeTe on various patterned structures such as electrodes, nanophotonic devices, and even ultrathin transmission electron microscopy (TEM) membranes are transferred. It is shown that the versatility of this technique further enables to perform on-chip nano-optomechanical measurements of an InP nanowire for the first time via evanescent field coupling. Thus, this technique facilitates effortless integration of single nanowires into applications that were previously seen as cumbersome or even impractical, spanning a wide range from TEM studies to in situ electrical, optical, and mechanical characterization.en
dc.description.versionPeer revieweden
dc.identifier.citationAli, U E, Yang, H, Khayrudinov, V, Modi, G, Cheng, Z, Agarwal, R, Lipsanen, H & Bhaskaran, H 2022, ' A Universal Pick-and-Place Assembly for Nanowires ', Small, vol. 18, no. 38, 2201968 . https://doi.org/10.1002/smll.202201968en
dc.identifier.otherPURE UUID: 4ed1c587-c25f-41b9-9113-a74eed1aefbeen_US
dc.identifier.otherPURE ITEMURL: https://research.aalto.fi/en/publications/4ed1c587-c25f-41b9-9113-a74eed1aefbeen_US
dc.identifier.otherPURE LINK: http://www.scopus.com/inward/record.url?scp=85135695240&partnerID=8YFLogxKen_US
dc.identifier.otherPURE FILEURL: https://research.aalto.fi/files/89118535/A_Universal_Pick_and_Place_Assembly_for_Nanowires.pdfen_US
dc.publisherWILEY-VCH VERLAG
dc.relation.ispartofseriesVolume 18, issue 38en
dc.subject.keywordcavity optomechanicsen_US
dc.titleA Universal Pick-and-Place Assembly for Nanowiresen
dc.typeA1 Alkuperäisartikkeli tieteellisessä aikakauslehdessäfi