Mechanical and thermomechanical properties of solder joints in cellular phone environment

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Journal Title
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Volume Title
Helsinki University of Technology | Diplomityö
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Date
1997
Major/Subject
Elektroniikan materiaali- ja valmistustekniikka
Mcode
Mak-113
Degree programme
Language
en
Pages
108
Series
Description
Supervisor
Kivilahti, Jorma
Thesis advisor
Forstén, Atso
Keywords
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Citation