Micromechanical ion source mode of silicon and glass
| dc.contributor | Aalto-yliopisto | fi |
| dc.contributor | Aalto University | en |
| dc.contributor.advisor | Franssila, Sami | |
| dc.contributor.author | Marttila, Seppo | |
| dc.contributor.department | Sähkö- ja tietoliikennetekniikan osasto | fi |
| dc.contributor.school | Teknillinen korkeakoulu | fi |
| dc.contributor.school | Helsinki University of Technology | en |
| dc.contributor.supervisor | Tittonen, Ilkka | |
| dc.date.accessioned | 2020-12-04T16:16:11Z | |
| dc.date.available | 2020-12-04T16:16:11Z | |
| dc.date.issued | 2003 | |
| dc.format.extent | ix + 83 | |
| dc.identifier.uri | https://aaltodoc.aalto.fi/handle/123456789/91285 | |
| dc.identifier.urn | URN:NBN:fi:aalto-2020120450120 | |
| dc.language.iso | fi | en |
| dc.programme.major | Mittaustekniikka | fi |
| dc.programme.mcode | S-108 | fi |
| dc.rights.accesslevel | closedAccess | |
| dc.subject.keyword | silicon etching | en |
| dc.subject.keyword | piin etsaus | fi |
| dc.subject.keyword | glass etching | en |
| dc.subject.keyword | lasin etsaus | fi |
| dc.subject.keyword | wafer bonding | en |
| dc.subject.keyword | kiekkobondaus | fi |
| dc.subject.keyword | mass spectrometry | en |
| dc.subject.keyword | massaspektrometria | fi |
| dc.subject.keyword | APCI | fi |
| dc.title | Micromechanical ion source mode of silicon and glass | en |
| dc.title | Mikromekaaninen ionilähde piitä ja lasia prosessoimalla | fi |
| dc.type.okm | G2 Pro gradu, diplomityö | |
| dc.type.ontasot | Master's thesis | en |
| dc.type.ontasot | Pro gradu -tutkielma | fi |
| dc.type.publication | masterThesis | |
| local.aalto.digiauth | ask | |
| local.aalto.digifolder | Aalto_35381 | |
| local.aalto.idinssi | 21172 | |
| local.aalto.inssilocation | P1 Ark S80 | |
| local.aalto.openaccess | no |