Direct-to-chip liquid cooling for reducing power consumption in a subarctic supercomputer centre

dc.contributorAalto-yliopistofi
dc.contributorAalto Universityen
dc.contributor.authorOvaska, Seppo J.en_US
dc.contributor.authorDragseth, Roy E.en_US
dc.contributor.authorHanssen, Svenn A.en_US
dc.contributor.departmentDepartment of Electrical Engineering and Automationen
dc.contributor.groupauthorIndustrial and Power Electronicsen
dc.contributor.organizationUiT The Arctic University of Norwayen_US
dc.date.accessioned2017-01-19T11:15:19Z
dc.date.issued2016en_US
dc.description.abstractReduction of data centre power consumption is a timely challenge. Waste heat reuse is another focus area when developing energy efficient and sustainable data centres. And these two issues are interconnected through liquid cooling of server racks and/or direct-to-chip liquid cooling. Both of these solutions make it possible to transfer a significant proportion of the waste heat energy back to profitable use. Nevertheless, the heat reusing opportunity is not the only benefit direct-to-chip liquid cooling may offer. Another benefit is the notable reduction of power consumption related to cooling fans associated with server blades and rack-level cooling systems. To evaluate this benefit, we performed power consumption and performance measurements in a subarctic supercomputer centre hosting a cluster of 632 blade nodes. Our study concentrated on a 47-node subset that we analysed when the servers were executing the LINPACK benchmark. Our conclusion is that direct-to-chip liquid cooling can reduce the total power consumption, in this case, up to 14.4% depending on the inlet air temperature.en
dc.description.versionPeer revieweden
dc.format.extent8
dc.format.extent242-249
dc.format.mimetypeapplication/pdfen_US
dc.identifier.citationOvaska, S J, Dragseth, R E & Hanssen, S A 2016, ' Direct-to-chip liquid cooling for reducing power consumption in a subarctic supercomputer centre ', International Journal of High Performance Computing and Networking, vol. 9, no. 3, pp. 242-249 . https://doi.org/10.1504/IJHPCN.2016.076269en
dc.identifier.doi10.1504/IJHPCN.2016.076269en_US
dc.identifier.issn1740-0562
dc.identifier.issn1740-0570
dc.identifier.otherPURE UUID: dd650f5e-2628-4331-9af5-4f5dd19ef728en_US
dc.identifier.otherPURE ITEMURL: https://research.aalto.fi/en/publications/dd650f5e-2628-4331-9af5-4f5dd19ef728en_US
dc.identifier.otherPURE LINK: http://www.scopus.com/inward/record.url?scp=84969263625&partnerID=8YFLogxKen_US
dc.identifier.otherPURE FILEURL: https://research.aalto.fi/files/9953443/Ovaska_IntJHighPerfCompNet_9_3_242.pdfen_US
dc.identifier.urihttps://aaltodoc.aalto.fi/handle/123456789/24355
dc.identifier.urnURN:NBN:fi:aalto-201701191300
dc.language.isoenen
dc.relation.ispartofseriesINTERNATIONAL JOURNAL OF HIGH PERFORMANCE COMPUTING AND NETWORKINGen
dc.relation.ispartofseriesVolume 9, issue 3en
dc.rightsopenAccessen
dc.subject.keywordData centreen_US
dc.subject.keywordDirect-to-chip liquid coolingen_US
dc.subject.keywordPower consumptionen_US
dc.subject.keywordSubarctic climateen_US
dc.subject.keywordSupercomputeren_US
dc.subject.keywordWaste heat reuseen_US
dc.titleDirect-to-chip liquid cooling for reducing power consumption in a subarctic supercomputer centreen
dc.typeA1 Alkuperäisartikkeli tieteellisessä aikakauslehdessäfi
dc.type.versionpublishedVersion

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