Direct-to-chip liquid cooling for reducing power consumption in a subarctic supercomputer centre
dc.contributor | Aalto-yliopisto | fi |
dc.contributor | Aalto University | en |
dc.contributor.author | Ovaska, Seppo J. | en_US |
dc.contributor.author | Dragseth, Roy E. | en_US |
dc.contributor.author | Hanssen, Svenn A. | en_US |
dc.contributor.department | Department of Electrical Engineering and Automation | en |
dc.contributor.groupauthor | Industrial and Power Electronics | en |
dc.contributor.organization | UiT The Arctic University of Norway | en_US |
dc.date.accessioned | 2017-01-19T11:15:19Z | |
dc.date.issued | 2016 | en_US |
dc.description.abstract | Reduction of data centre power consumption is a timely challenge. Waste heat reuse is another focus area when developing energy efficient and sustainable data centres. And these two issues are interconnected through liquid cooling of server racks and/or direct-to-chip liquid cooling. Both of these solutions make it possible to transfer a significant proportion of the waste heat energy back to profitable use. Nevertheless, the heat reusing opportunity is not the only benefit direct-to-chip liquid cooling may offer. Another benefit is the notable reduction of power consumption related to cooling fans associated with server blades and rack-level cooling systems. To evaluate this benefit, we performed power consumption and performance measurements in a subarctic supercomputer centre hosting a cluster of 632 blade nodes. Our study concentrated on a 47-node subset that we analysed when the servers were executing the LINPACK benchmark. Our conclusion is that direct-to-chip liquid cooling can reduce the total power consumption, in this case, up to 14.4% depending on the inlet air temperature. | en |
dc.description.version | Peer reviewed | en |
dc.format.extent | 8 | |
dc.format.extent | 242-249 | |
dc.format.mimetype | application/pdf | en_US |
dc.identifier.citation | Ovaska, S J, Dragseth, R E & Hanssen, S A 2016, ' Direct-to-chip liquid cooling for reducing power consumption in a subarctic supercomputer centre ', International Journal of High Performance Computing and Networking, vol. 9, no. 3, pp. 242-249 . https://doi.org/10.1504/IJHPCN.2016.076269 | en |
dc.identifier.doi | 10.1504/IJHPCN.2016.076269 | en_US |
dc.identifier.issn | 1740-0562 | |
dc.identifier.issn | 1740-0570 | |
dc.identifier.other | PURE UUID: dd650f5e-2628-4331-9af5-4f5dd19ef728 | en_US |
dc.identifier.other | PURE ITEMURL: https://research.aalto.fi/en/publications/dd650f5e-2628-4331-9af5-4f5dd19ef728 | en_US |
dc.identifier.other | PURE LINK: http://www.scopus.com/inward/record.url?scp=84969263625&partnerID=8YFLogxK | en_US |
dc.identifier.other | PURE FILEURL: https://research.aalto.fi/files/9953443/Ovaska_IntJHighPerfCompNet_9_3_242.pdf | en_US |
dc.identifier.uri | https://aaltodoc.aalto.fi/handle/123456789/24355 | |
dc.identifier.urn | URN:NBN:fi:aalto-201701191300 | |
dc.language.iso | en | en |
dc.relation.ispartofseries | INTERNATIONAL JOURNAL OF HIGH PERFORMANCE COMPUTING AND NETWORKING | en |
dc.relation.ispartofseries | Volume 9, issue 3 | en |
dc.rights | openAccess | en |
dc.subject.keyword | Data centre | en_US |
dc.subject.keyword | Direct-to-chip liquid cooling | en_US |
dc.subject.keyword | Power consumption | en_US |
dc.subject.keyword | Subarctic climate | en_US |
dc.subject.keyword | Supercomputer | en_US |
dc.subject.keyword | Waste heat reuse | en_US |
dc.title | Direct-to-chip liquid cooling for reducing power consumption in a subarctic supercomputer centre | en |
dc.type | A1 Alkuperäisartikkeli tieteellisessä aikakauslehdessä | fi |
dc.type.version | publishedVersion |