Crossover between Electron-Phonon and Boundary-Resistance Limits to Thermal Relaxation in Copper Films
Loading...
Access rights
openAccess
publishedVersion
URL
Journal Title
Journal ISSN
Volume Title
A1 Alkuperäisartikkeli tieteellisessä aikakauslehdessä
This publication is imported from Aalto University research portal.
View publication in the Research portal (opens in new window)
View/Open full text file from the Research portal (opens in new window)
View publication in the Research portal (opens in new window)
View/Open full text file from the Research portal (opens in new window)
Date
Department
Major/Subject
Mcode
Degree programme
Language
en
Pages
6
Series
Physical Review Applied, Volume 12, issue 2, pp. 1-6
Abstract
We observe a crossover fromelectron-phonon (e-ph) coupling limited energy relaxation to that governed by thermal boundary resistance (phonon-phonon coupling, ph-ph) in copper films at subkelvin temperatures. Our measurement yields a quantitative picture of heat currents, in terms of temperature dependences and magnitudes, in both e-ph and pp limited regimes, respectively. We show that by adding a third layer in between the copper film and the substrate, the thermal boundary resistance is increased fourfold, consistent with an assumed series connection of thermal resistances.Description
| openaire: EC/H2020/742559/EU//SQH
Keywords
Other note
Citation
Wang, L B, Saira, O-P, Golubev, D S & Pekola, J P 2019, 'Crossover between Electron-Phonon and Boundary-Resistance Limits to Thermal Relaxation in Copper Films', Physical Review Applied, vol. 12, no. 2, 024051, pp. 1-6. https://doi.org/10.1103/PhysRevApplied.12.024051