Creep effects in diffusion bonding of oxygen-free copper

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Volume Title

Perustieteiden korkeakoulu | Bachelor's thesis
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Date

2013-04-17

Department

Major/Subject

Teknillinen fysiikka

Mcode

F3005

Degree programme

Teknillinen fysiikka ja matematiikka TFM

Language

en

Pages

44

Series

Description

Supervisor

Alava, Mikko

Thesis advisor

Alava, Mikko

Keywords

diffusion, diffusion bonding, creep, oxygen-free copper, finite element method

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