Flip-chip packaging for millimeter-wave integrated circuits

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Sähkötekniikan korkeakoulu | Master's thesis
Ask about the availability of the thesis by sending email to the Aalto University Learning Centre oppimiskeskus@aalto.fi

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ELEC3036

Language

en

Pages

57+6

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Supervisor

Halonen, Kari

Thesis advisor

Vähä-heikkilä, Tauno

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