Flip-chip packaging for millimeter-wave integrated circuits

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Journal Title
Journal ISSN
Volume Title
Sähkötekniikan korkeakoulu | Master's thesis
Ask about the availability of the thesis by sending email to the Aalto University Learning Centre oppimiskeskus@aalto.fi
Date
2016-12-12
Department
Major/Subject
Mikro- ja nanoelektroniikkasuunnittelu
Mcode
ELEC3036
Degree programme
NanoRad - Master’s Programme in Nano and Radio Sciences (TS2013)
Language
en
Pages
57+6
Series
Description
Supervisor
Halonen, Kari
Thesis advisor
Vähä-heikkilä, Tauno
Keywords
flip-chip, MMIC, interconnect, millimeter wave, integrated circuit
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