The effect of temperature cycling dwell times on failure mechanisms and lifetimes of Sn-Ag-Cu solder joints

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Journal Title
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Volume Title
School of Chemical Engineering | Master's thesis
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Date
2010
Major/Subject
Elektroniikan valmistustekniikka
Mcode
S-113
Degree programme
Language
fi
Pages
vi + 135
Series
Description
Supervisor
Paulasto-Kröckel, Mervi
Thesis advisor
Mattila, Toni
Keywords
thermal cycling, lämpösyklaus, failure mechanism, vauriomekanismi, dwell time, pitoaika
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