aalto1 untyped-item.component.html

Thermal budget of superconducting digital circuits at subkelvin temperatures

Loading...
Thumbnail Image

Access rights

© 2006 American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior permission of the author and the American Institute of Physics. The following article appeared in Journal of Applied Physics, Volume 99, Issue 8 and may be found at http://scitation.aip.org/content/aip/journal/jap/99/8/10.1063/1.2187276
Final published version

URL

Journal Title

Journal ISSN

Volume Title

School of Science | A1 Alkuperäisartikkeli tieteellisessä aikakauslehdessä

Date

Major/Subject

Mcode

Degree programme

Language

en

Pages

084501/1-9

Series

Journal of Applied Physics, Volume 99, Issue 8

Abstract

Superconducting single-flux-quantum (SFQ) circuits have so far been developed and optimized for operation at or above helium temperatures. The SFQ approach, however, should also provide potentially viable and scalable control and readout circuits for Josephson-junction qubits and other applications with much lower, millikelvin, operating temperatures. This paper analyzes the overheating problem which becomes important in this temperature range. We suggest a thermal model of the SFQ circuits at subkelvin temperatures and present experimental results on overheating of electrons and silicon substrate which support this model. The model establishes quantitative limitations on the dissipated power both for “local” electron overheating in resistors and “global” overheating due to ballistic phonon propagation along the substrate. Possible changes in the thermal design of SFQ circuits in view of the overheating problem are also discussed.

Description

Other note

Citation

Savin, A. M. & Pekola, Jukka & Averin, D. V. & Semenov, V. K. 2006. Thermal budget of superconducting digital circuits at subkelvin temperatures. Journal of Applied Physics. Volume 99, Issue 8. 084501/1-9. ISSN 0021-8979 (printed). DOI: 10.1063/1.2187276.

Endorsement

Review

Supplemented By

Referenced By