Test Circuit For IC Encapsulation Quality
dc.contributor | Aalto-yliopisto | fi |
dc.contributor | Aalto University | en |
dc.contributor.advisor | Marjanen, Lasse | |
dc.contributor.author | Talonen, Juha | |
dc.contributor.department | Sähkö- ja tietoliikennetekniikan osasto | fi |
dc.contributor.school | Teknillinen korkeakoulu | fi |
dc.contributor.school | Helsinki University of Technology | en |
dc.contributor.supervisor | Halonen, Kari | |
dc.date.accessioned | 2020-12-03T20:28:38Z | |
dc.date.available | 2020-12-03T20:28:38Z | |
dc.date.issued | 1997 | |
dc.format.extent | 77 | |
dc.identifier.uri | https://aaltodoc.aalto.fi/handle/123456789/84898 | |
dc.identifier.urn | URN:NBN:fi:aalto-2020120343736 | |
dc.language.iso | en | en |
dc.programme.major | Piiritekniikka | fi |
dc.programme.mcode | S-87 | fi |
dc.rights.accesslevel | closedAccess | |
dc.subject.keyword | integrated circuit | fi |
dc.subject.keyword | package | fi |
dc.subject.keyword | encapsulation | fi |
dc.subject.keyword | stress | fi |
dc.subject.keyword | leakage | fi |
dc.subject.keyword | corrosion | fi |
dc.subject.keyword | moisture | fi |
dc.subject.keyword | failure | fi |
dc.subject.keyword | sensitivity | fi |
dc.subject.keyword | integroitu piiri | fi |
dc.subject.keyword | kotelo | fi |
dc.subject.keyword | rasitus | fi |
dc.subject.keyword | vuotovirta | fi |
dc.subject.keyword | korroosio | fi |
dc.subject.keyword | kosteus | fi |
dc.subject.keyword | vikaantuminen | fi |
dc.subject.keyword | herkkyys | fi |
dc.title | Test Circuit For IC Encapsulation Quality | en |
dc.type.okm | G2 Pro gradu, diplomityö | |
dc.type.ontasot | Master's thesis | en |
dc.type.ontasot | Pro gradu -tutkielma | fi |
dc.type.publication | masterThesis | |
local.aalto.digiauth | ask | |
local.aalto.digifolder | Aalto_36650 | |
local.aalto.idinssi | 12073 | |
local.aalto.openaccess | no |