Test Circuit For IC Encapsulation Quality

dc.contributorAalto-yliopistofi
dc.contributorAalto Universityen
dc.contributor.advisorMarjanen, Lasse
dc.contributor.authorTalonen, Juha
dc.contributor.departmentSähkö- ja tietoliikennetekniikan osastofi
dc.contributor.schoolTeknillinen korkeakoulufi
dc.contributor.schoolHelsinki University of Technologyen
dc.contributor.supervisorHalonen, Kari
dc.date.accessioned2020-12-03T20:28:38Z
dc.date.available2020-12-03T20:28:38Z
dc.date.issued1997
dc.format.extent77
dc.identifier.urihttps://aaltodoc.aalto.fi/handle/123456789/84898
dc.identifier.urnURN:NBN:fi:aalto-2020120343736
dc.language.isoenen
dc.programme.majorPiiritekniikkafi
dc.programme.mcodeS-87fi
dc.rights.accesslevelclosedAccess
dc.subject.keywordintegrated circuitfi
dc.subject.keywordpackagefi
dc.subject.keywordencapsulationfi
dc.subject.keywordstressfi
dc.subject.keywordleakagefi
dc.subject.keywordcorrosionfi
dc.subject.keywordmoisturefi
dc.subject.keywordfailurefi
dc.subject.keywordsensitivityfi
dc.subject.keywordintegroitu piirifi
dc.subject.keywordkotelofi
dc.subject.keywordrasitusfi
dc.subject.keywordvuotovirtafi
dc.subject.keywordkorroosiofi
dc.subject.keywordkosteusfi
dc.subject.keywordvikaantuminenfi
dc.subject.keywordherkkyysfi
dc.titleTest Circuit For IC Encapsulation Qualityen
dc.type.okmG2 Pro gradu, diplomityö
dc.type.ontasotMaster's thesisen
dc.type.ontasotPro gradu -tutkielmafi
dc.type.publicationmasterThesis
local.aalto.digiauthask
local.aalto.digifolderAalto_36650
local.aalto.idinssi12073
local.aalto.openaccessno

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