Test Circuit For IC Encapsulation Quality
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Helsinki University of Technology |
Diplomityö
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Instructions for the author
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Date
1997
Department
Major/Subject
Piiritekniikka
Mcode
S-87
Degree programme
Language
en
Pages
77
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Description
Supervisor
Halonen, KariThesis advisor
Marjanen, LasseKeywords
integrated circuit, package, encapsulation, stress, leakage, corrosion, moisture, failure, sensitivity, integroitu piiri, kotelo, rasitus, vuotovirta, korroosio, kosteus, vikaantuminen, herkkyys