Crystal plasticity model for creep and relaxation deformation of OFP copper
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A1 Alkuperäisartikkeli tieteellisessä aikakauslehdessä
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Date
2024
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Language
en
Pages
10
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MATERIALS AT HIGH TEMPERATURES, Volume 41, issue 1, pp. 51-60
Abstract
We demonstrate a dislocation density-based crystal plasticity (CP) model approach for simulating mesoscale deformation and damage. The existing CP framework is extended to be compatible with the oxygen-free phosphorous copper microstructure that is the focus of this study. The key aim is to introduce relevant plastic deformation mechanisms and to develop a failure model capable of depicting creep damage in the material. The effect of local variations in material is evaluated, and the model response is compared with experiments and characterisation. The basis of this work is CP material modelling, including grain orientation and size, obtained using electron backscatter diffraction and experimental test data of real relaxation test specimens. This will yield a realistic description of texture and grain shape and, ultimately, accurate stress–strain response at the microstructural level for further evaluation of performance with respect to material creep(−fatigue) damage.Description
Funding Information: The authors wish to acknowledge the financial support of the Finnish Research Programme on Nuclear Waste Management, via the CRYCO project No. KYT15/2020 and Academy of Finland, via the EARLY project No. 325108. Publisher Copyright: © 2023 The Author(s). Published by Informa UK Limited, trading as Taylor & Francis Group.
Keywords
Creep, creep cavity, crystal plasticity modelling
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Citation
Andersson, T, Lindroos, M, Pohja, R, Biswas, A, Nandy, S, Pakarinen, J & Rantala, J 2024, ' Crystal plasticity model for creep and relaxation deformation of OFP copper ', Materials at high temperatures, vol. 41, no. 1, pp. 51-60 . https://doi.org/10.1080/09603409.2023.2278232