Electronic cooling a submicron-sized metallic beam
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A1 Alkuperäisartikkeli tieteellisessä aikakauslehdessä
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Date
2009
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Language
en
Pages
3
1-3
1-3
Series
Applied Physics Letters, Volume 94, issue 7
Abstract
We demonstrate electronic cooling of a suspended AuPd island using superconductor-insulator-normal metal tunnel junctions. This was achieved by developing a simple fabrication method for reliably releasing narrow submicron-sized metal beams. The process is based on reactive ion etching and uses a conducting substrate to avoid charge-up damage and is compatible with, e.g., conventional e-beam lithography, shadow-angle metal deposition, and oxide tunnel junctions. The devices function well and exhibit clear cooling, up to a factor of 2 at sub-Kelvin temperatures.Description
Keywords
electronic cooling, netallic beam
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Citation
Muhonen , J , Niskanen , A , Meschke , M , Pashkin , Y , Tsai , J S , Sainiemi , L , Franssila , S & Pekola , J 2009 , ' Electronic cooling a submicron-sized metallic beam ' , Applied Physics Letters , vol. 94 , no. 7 , 073101 , pp. 1-3 . https://doi.org/10.1063/1.3080668