Reliability testing methods for circuit board solder joints

Abstract

This bachelor’s thesis explores the different reliability testing methods for circuit board solder joints. Reliability testing provides ways to estimate solder joint life expectancy and to identify weaknesses in the circuit board solder joints. This is important as without it is easier and cheaper to find any defects before the products are sent to customers who would eventually encounter the defects over time.

This bachelor’s thesis reviews the most important reliability testing standards by IEC, AEC, IPC and JEDEC. These standards provide guidelines to conduct reliability testing by providing concrete numbers on testing temperature et cetera. After introducing the most important standards, the different testing methods covered in the standards are introduced and their characteristics are discussed. The different testing methods discussed are temperature cycling, functional cycling, temperature shock testing, constant temperature testing, humidity testing and vibration testing. After introducing the testing methods, testing results such as failure modes are discussed, and two different life expectancy estimations are introduced. In the end, the main points of the thesis are gathered to a short form.