Processing and interconnections of semiconductor sensors for photon and particle radiation detection
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School of Chemical Technology |
Doctoral thesis (article-based)
| Defence date: 2021-11-05
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Authors
Date
2021
Major/Subject
Mcode
Degree programme
Language
en
Pages
110 + app. 68
Series
Aalto University publication series DOCTORAL DISSERTATIONS, 145/2021, HIP Internal Report Series, 2021-04
Abstract
Semiconductor radiation detectors have made tremendous progress in the past few decades, increasing our understanding of physics with their detection precision. Despite these advances, there are several items that can be improved and developed. For instance, the method of sensor fabrication can be more simplified thus, the attention is given to the sensor processing this research. The detector bare module consisted of a segmented semiconductor sensor and an ASIC read-out chip (ROC). In the case of pixel detectors, the interconnection technology enables to complete a hybrid bare module. The hybrid bare module based on PSI46dig ROC read-out was used for this research with a read-out capability is 160 Mbit/s with a chip size of 7.9 × 10.3 mm2. The produced sensors were designed and fabricated in accordance with this ROC design. This thesis focuses especially on processing of sensors made of silicon and CdTe materials. Interconnection technology efforts are also emphasized as well. In particular, the research scope was to implement a more simple process introducing atomic layer deposition (ALD) thin film technology and the preparation of future higher density sensor structures. The characterization of sensors have been carried out by laboratory measurements using probe stations and transition current technique (TCT) measurements. Furthermore, functional tests of modules using different radioactive sources have been performed with a full read-out chain.Description
Defence is held on 5.11.2021 12:00 – 15:00
https://aalto.zoom.us/j/66095957049
Supervising professor
Franssila, Sami, Prof., Aalto University, Department of Chemistry and Materials Science, FinlandThesis advisor
Härkönen Jaakko, Dr., Helsinki Institute of Physics, Finland, Prof., Ludong University, ChinaLuukka, Panja, Prof., Helsinki Institute of Physics and Lappeenranta-Lahti University of Technology, Finland
Keywords
silicon, GaAs, CdTe, pixel detector, ALD, flip chip bonding
Other note
Parts
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[Publication 1]: Gädda, J. Ott, S. Bharthuar, E. Brücken, M. Kalliokoski, A. Karadzhinova-Ferrer, M. Bezak, S. Kirschenmann, V. Litichevskyi, M. Golovleva, L. Martikainen, A. Winkler, V. Chmil, E. Tuovinen, P. Luukka, J. Härkönen. AC-coupled n-in-p pixel detectors on MCz silicon with atomic layer deposition (ALD) grown thin film. Nuclear Instruments and Methods in Physics Research A: Accelerators spectrometers detectors and associated equipment, Volume 986, Pages 164714, January 2021.
Full text in Acris/Aaltodoc: http://urn.fi/URN:NBN:fi:aalto-202010235929DOI: 10.1016/j.nima.2020.164714 View at publisher
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[Publication 2]: A. Gädda, J. Ott, A. Karadzhinova-Ferrer, M. Golovlevaa, M. Kalliokoski, A. Winkler, P. Luukka, J. Härkönen. Cadmium Telluride X-ray pad detectors with different passivation dielectrics. Nuclear Instruments and Methods in Physics Research A: Accelerators spectrometers detectors and associated equipment, Volume 924, Pages 33-37, April 2019.
DOI: 10.1016/j.nima.2018.08.063 View at publisher
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[Publication 3]: A. Gädda, A. Winkler, J. Ott, J. Härkönen, A. Karadzhinova-Ferrer, A. Koponen, P. Luukka, J. Tikkanen, S. Vähänen. Advanced processing of CdTe pixel radiation detectors. Journal of Instrumentation, Volume 12, C12031, December 2017.
DOI: 10.1088/1748-0221/12/12/C12031 View at publisher
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[Publication 4]: J. Ott, A. Gädda, S. Bharthuar, E. Brücken, M. Golovleva, J. Härkönen, M. Kalliokoski, A. Karadzhinova-Ferrer, S. Kirschenmann, V. Litichevskyi, P. Luukka, L. Martikainen, T. Naaranoja. Processing of AC-coupled n-in-p pixel detectors on MCz silicon using atomic layer deposited aluminium oxide. Nuclear Instruments and Meth- ods in Physics Research A: Accelerators spectrometers detectors and associated equipment, Volume 958, Pages 162547, April 2020.
Full text in Acris/Aaltodoc: http://urn.fi/URN:NBN:fi:aalto-202103312652DOI: 10.1016/j.nima.2019.162547 View at publisher
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[Publication 5]: S. Spannagel on behalf of CMS Tracker Collaboration. Test beam performance measurements for the Phase I upgrade of the CMS pixel detector. IOP Journal of Instrumentation, Volume 12, Pages P05022, May 2017.
DOI: 10.1088/1748-0221/12/05/P05022 View at publisher