Application of Hybrid Friction Stir Channeling (HFSC) technique to improve the cooling efficiency of electronic components
dc.contributor | Aalto-yliopisto | fi |
dc.contributor | Aalto University | en |
dc.contributor.author | Karvinen, Heikki | en_US |
dc.contributor.author | Nordal, Daniel | en_US |
dc.contributor.author | Galkin, Timo | en_US |
dc.contributor.author | Santos Vilaca da Silva, Pedro | en_US |
dc.contributor.department | Department of Energy and Mechanical Engineering | en |
dc.contributor.groupauthor | Engineering Materials | en |
dc.contributor.organization | Nokia | en_US |
dc.date.accessioned | 2018-02-09T09:55:18Z | |
dc.date.available | 2018-02-09T09:55:18Z | |
dc.date.issued | 2017 | en_US |
dc.format.extent | 14 | |
dc.format.mimetype | application/pdf | en_US |
dc.identifier.citation | Karvinen, H, Nordal, D, Galkin, T & Santos Vilaca da Silva, P 2017, Application of Hybrid Friction Stir Channeling (HFSC) technique to improve the cooling efficiency of electronic components. in 70th International Institute of Welding Annual Assembly and International Conference, IIW 2017., III-1799-17, International Institute of Welding Annual Assembly and International Conference, Shanghai, China, 25/06/2017. | en |
dc.identifier.other | PURE UUID: 34292ef2-3f7a-4f15-b1fd-53af97992681 | en_US |
dc.identifier.other | PURE ITEMURL: https://research.aalto.fi/en/publications/34292ef2-3f7a-4f15-b1fd-53af97992681 | en_US |
dc.identifier.other | PURE FILEURL: https://research.aalto.fi/files/17217850/III_1799_17_IIW2017_HKarvinen_etal_Aalto.pdf | en_US |
dc.identifier.uri | https://aaltodoc.aalto.fi/handle/123456789/29776 | |
dc.identifier.urn | URN:NBN:fi:aalto-201802091272 | |
dc.language.iso | en | en |
dc.relation.ispartof | International Institute of Welding Annual Assembly and International Conference | en |
dc.relation.ispartofseries | 70th International Institute of Welding Annual Assembly and International Conference, IIW 2017 | en |
dc.rights | openAccess | en |
dc.title | Application of Hybrid Friction Stir Channeling (HFSC) technique to improve the cooling efficiency of electronic components | en |
dc.type | A4 Artikkeli konferenssijulkaisussa | fi |
dc.type.version | acceptedVersion |