Optical metrology of 3D thin film conformality by LHAR chip assisted method
dc.contributor | Aalto-yliopisto | fi |
dc.contributor | Aalto University | en |
dc.contributor.author | Utriainen, Mikko | en_US |
dc.contributor.author | Saastamoinen, Kimmo | en_US |
dc.contributor.author | Rekola, Heikki | en_US |
dc.contributor.author | Ylivaara, Oili M.E. | en_US |
dc.contributor.author | Puurunen, Riikka L. | en_US |
dc.contributor.author | Hyttinen, Pasi | en_US |
dc.contributor.department | Department of Chemical and Metallurgical Engineering | en |
dc.contributor.editor | Busse, Lynda E. | en_US |
dc.contributor.editor | Soskind, Yakov | en_US |
dc.contributor.editor | Mock, Patrick C. | en_US |
dc.contributor.groupauthor | Catalysis | en |
dc.contributor.organization | Chipmetrics Ltd | en_US |
dc.contributor.organization | University of Eastern Finland | en_US |
dc.contributor.organization | VTT Technical Research Centre of Finland | en_US |
dc.date.accessioned | 2022-06-15T06:40:04Z | |
dc.date.available | 2022-06-15T06:40:04Z | |
dc.date.issued | 2022-03-05 | en_US |
dc.description | Publisher Copyright: © COPYRIGHT SPIE. Downloading of the abstract is permitted for personal use only. | |
dc.description.abstract | The paper presents a novel and fast method to characterize thin film conformality on microscopic 3D High Aspect Ratio substrates. The thin film deposition experiment uses specially designed PillarHall(TM) Lateral High Aspect Ratio (LHAR) silicon chip as a substrate. The measurement on a chip relies on the conventional planar surface characterization tools such as optical microscopy, line-scan reflectometry and ellipsometry. The results show that the method is fast and accurate way to characterize thin film conformality as well as other film properties, and also in wafer-level. | en |
dc.description.version | Peer reviewed | en |
dc.format.mimetype | application/pdf | en_US |
dc.identifier.citation | Utriainen, M, Saastamoinen, K, Rekola, H, Ylivaara, O M E, Puurunen, R L & Hyttinen, P 2022, Optical metrology of 3D thin film conformality by LHAR chip assisted method. in L E Busse, Y Soskind & P C Mock (eds), Photonic Instrumentation Engineering IX., 120080D, Proceedings of SPIE - The International Society for Optical Engineering, vol. 12008, SPIE, SPIE Photonics West, San Francisco, California, United States, 22/01/2022. https://doi.org/10.1117/12.2609643 | en |
dc.identifier.doi | 10.1117/12.2609643 | en_US |
dc.identifier.isbn | 978-1-5106-4887-6 | |
dc.identifier.issn | 0277-786X | |
dc.identifier.issn | 1996-756X | |
dc.identifier.other | PURE UUID: bf2538ed-f136-4eaa-80b8-55be720df94e | en_US |
dc.identifier.other | PURE ITEMURL: https://research.aalto.fi/en/publications/bf2538ed-f136-4eaa-80b8-55be720df94e | en_US |
dc.identifier.other | PURE LINK: http://www.scopus.com/inward/record.url?scp=85131219362&partnerID=8YFLogxK | |
dc.identifier.other | PURE FILEURL: https://research.aalto.fi/files/84468163/CHEM_Utriainen_et_al_Optical_metrology_2022_Proc_SPIE_12008.pdf | en_US |
dc.identifier.uri | https://aaltodoc.aalto.fi/handle/123456789/114980 | |
dc.identifier.urn | URN:NBN:fi:aalto-202206153822 | |
dc.language.iso | en | en |
dc.relation.ispartof | SPIE Photonics West | en |
dc.relation.ispartofseries | Photonic Instrumentation Engineering IX | en |
dc.relation.ispartofseries | Proceedings of SPIE - The International Society for Optical Engineering ; Volume 12008 | en |
dc.rights | openAccess | en |
dc.subject.keyword | ALD | en_US |
dc.subject.keyword | Conformal | en_US |
dc.subject.keyword | High Aspect Ratio | en_US |
dc.subject.keyword | LHAR | en_US |
dc.title | Optical metrology of 3D thin film conformality by LHAR chip assisted method | en |
dc.type | A4 Artikkeli konferenssijulkaisussa | fi |
dc.type.version | publishedVersion |