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Development of piezoelectric microelectromechanical systems for multiaxial motion and sensing
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School of Electrical Engineering |
Doctoral thesis (article-based)
| Defence date: 2024-03-15
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Language
en
Pages
80 + app. 68
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Aalto University publication series DOCTORAL THESES, 43/2024
Abstract
Piezoelectric materials offer several advantages for MEMS applications due to their superior direct electromechanical coupling and low voltage consumption, especially when compared to electrostatic-based MEMS. Integrating piezoelectric thin films in MEMS also allows for a significantly smaller chip footprint than devices employing other transduction techniques. Furthermore, thin piezoelectric films can be integrated into the fabrication of multifunctional devices capable of three-dimensional motion (3D motion). Such 3D piezoMEMS enable driving and sensing along the x, y, or z-axes using components of a single element. This distinguishes 3D piezoMEMS from conventional MEMS that utilize elements that often facilitate motion in only one direction.
This dissertation investigates the development of a new fabrication approach and adapting and optimizing existing fabrication techniques for 3D piezoMEMS fabrication. Pure lateral motion of a single MEMS element is implemented by placing metal organic chemical vapour deposited aluminium nitride (MOCVD AlN) thin films on the vertical surfaces of the Si cantilever. The fabrication approach demonstrated in the work unlocks the piezoelectric and electrode material deposition potential on vertical sidewall structures in the fabrication of advanced 3D piezoMEMS.
Description
Supervising professor
Paulasto-Kröckel, Mervi, Prof., Aalto University, Department of Electrical Engineering and Automation, FinlandThesis advisor
Ross, Glenn, Dr., Aalto University, Department of Electrical Engineering and Automation, FinlandKeywords
aluminium nitride, microelectromechanical systems, metal organic chemical vapour deposition, vertical sidewalls, vertical surfaces, aluminium scandium nitride, piezoelectric materials, piezoelectricity, microstructure, thin films, X-ray diffraction, microfabrication, scanning transmission electron microscopy, finite-element method, surface quality, cavity first approach, motion test
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Parts
- Kristina Bespalova, Elmeri Österlund, Glenn Ross, Mervi Paulasto-Kröckel, Abhilash Thanniyil Sebastian, Cyril Baby Karuthedath, Stefan Mertin, Tuomas Pensala. 2021. Characterization of AlScN-Based Multilayer Systems for Piezoelectric Micromachined Ultrasound Transducer (pMUT) Fabrication. IEEE. Journal of Microelectromechanical Systems, volume 30, issue 2 (April 2021), p. 290-298.
Full text in Acris/Aaltodoc: https://urn.fi/URN:NBN:fi:aalto-202102262074DOI: 10.1109/JMEMS.2021.3056928 View at publisher
- Kristina Bespalova, Tarmo Nieminen, Artem Gabrelian, Ross Glenn, Mervi Paulasto-Kröckel. 2023. In-Plane AlN-based Actuator: Toward a New Generation of Piezoelectric MEMS. Wiley. Advanced Electronic Materials , vol. 9 , no. 8 , 2300015.
Full text in Acris/Aaltodoc: https://urn.fi/URN:NBN:fi:aalto-202308114727DOI: 10.1002/aelm.202300015 View at publisher
- Kristina Bespalova, Glenn Ross, Sami Suihkonen, Mervi Paulasto-Kröckel. 2024. Metalorganic Chemical Vapor Deposition of AlN on High Degree Roughness Vertical Surfaces for MEMS Fabrication. Wiley. Advanced Electronic Materials, Jan 15, p.2300628.
Full text in Acris/Aaltodoc: https://urn.fi/URN:NBN:fi:aalto-202401312260DOI: 10.1002/aelm.202300628 View at publisher
- Elmeri Österlund, Heli Seppänen, Kristina Bespalova, Ville Miikkulainen, Mervi Paulasto-Kröckel. 2021. Atomic layer deposition of AlN using atomic layer annealing - Towards high-quality AlN on vertical sidewalls. Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, volume 39, no. 3, p. 032403.
Full text in Acris/Aaltodoc: https://urn.fi/URN:NBN:fi:aalto-202103312669DOI: 10.1116/6.0000724 View at publisher
- Artem Gabrelian, Glenn Ross, Kristina Bespalova, Mervi Paulasto-Kröckel. 2022. Unlocking the Potential of Piezoelectric Films Grown on Vertical Surfaces for Inertial MEMS. Materials Today Communications, volume 33, p. 104522.
Full text in Acris/Aaltodoc: https://urn.fi/URN:NBN:fi:aalto-202212076793DOI: 10.1016/j.mtcomm.2022.104522 View at publisher