In-line Vector Modulator Integration in Dielectric-filled Waveguide

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Journal Title
Journal ISSN
Volume Title
A1 Alkuperäisartikkeli tieteellisessä aikakauslehdessä
Date
2023-02-01
Major/Subject
Mcode
Degree programme
Language
en
Pages
8
153-160
Series
IEEE Transactions on Components, Packaging and Manufacturing Technology, Volume 13, issue 2
Abstract
This article proposes a scalable substrate-integrated waveguide (SIW) module accommodating an in-line vector modulator monolithic millimeter integrated circuit (MMIC). The SIW module is realized with low-temperature co-fired ceramic (LTCC) technology, and it can be inserted in a dielectric-filled waveguide (DFWG). The module combines $\lambda {g}/4$ -transformer-based $E$ plane tapering and SIWs on LTCC with the wire-bonded vector modulator. The proposed active LTCC module and two passive test structures (i.e., a constant-height-SIW module and a SIW module with $E$ plane taperings) are manufactured and tested as in-line modules in a DFWG. The passive test structures with the waveguide-to-DFWG and DFWG-to-SIW transitions measure 3.1 and 4.6 dB of insertion loss on average, respectively, at the 71-81 GHz frequency range. The active LTCC module measurements demonstrate a DFWG with phase and amplitude tuning capability and gain up to 17.6 dB within the same frequency range. A four-channel mock-up module with $\lambda {0}/2$ channel spacing is designed and manufactured to demonstrate the scalability of the design.
Description
Publisher Copyright: Author
Keywords
Antenna components, Antenna feeds, Arrayed waveguide gratings, E-Band, Frequency measurement, Gain, Low-temperature co-fired ceramic (LTCC), Modulation, Phased arrays, Prototypes, Substrate-integrated waveguide (SIW), Waveguide component, Waveguide transitions, Wires
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Citation
Haarla , J , Ala-Laurinaho , J , Lahti , M , Varonen , M , Kantanen , M , Holmberg , J & Viikari , V 2023 , ' In-line Vector Modulator Integration in Dielectric-filled Waveguide ' , IEEE Transactions on Components, Packaging and Manufacturing Technology , vol. 13 , no. 2 , pp. 153-160 . https://doi.org/10.1109/TCPMT.2023.3244865