Lead-Free Flip Chip On Board Assembly

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Journal Title

Journal ISSN

Volume Title

Helsinki University of Technology | Diplomityö
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Date

2000

Major/Subject

Elektroniikan valmistustekniikka

Mcode

S-113

Degree programme

Language

en

Pages

98 s. + liitt. 2

Series

Description

Supervisor

Kivilahti, Jorma

Thesis advisor

Kujala, Kauppi

Keywords

flip chip, Sn/Ag/Cu, lead-free, lyijyttömyys, reliability, luotettavuus, electronics packaging, elektroniikan pakkaus, cellular phone, matkapuhelin

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