Lead-Free Flip Chip On Board Assembly
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Journal Title
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Volume Title
Helsinki University of Technology |
Diplomityö
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Instructions for the author
Authors
Date
2000
Department
Major/Subject
Elektroniikan valmistustekniikka
Mcode
S-113
Degree programme
Language
en
Pages
98 s. + liitt. 2
Series
Description
Supervisor
Kivilahti, JormaThesis advisor
Kujala, KauppiKeywords
flip chip, Sn/Ag/Cu, lead-free, lyijyttömyys, reliability, luotettavuus, electronics packaging, elektroniikan pakkaus, cellular phone, matkapuhelin