MOVPE growth of GaN on patterned 6-inch Si wafer

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openAccess

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Journal Title

Journal ISSN

Volume Title

A1 Alkuperäisartikkeli tieteellisessä aikakauslehdessä

Date

2020-04-20

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Mcode

Degree programme

Language

en

Pages

45010

Series

Journal of Physics Communications, Volume 4, issue 4

Abstract

We demonstrate that thicker layers can be achieved in gallium nitride (GaN) epitaxy by using a patterned silicon (Si) substrate compared to a planar Si substrate. GaN films were grown by metalorganic vapour-phase epitaxy on 6-inch Si (111) substrates patterned with arrays of squares with various corner shapes, height and lateral dimensions. Stress spatial distributions in the GaN pattern units were mapped out using confocal Raman spectroscopy. It was found that the corner shapes have an effect on the uniformity of the stress distribution. Patterns with round corners were found to have more uniform stress distribution than those with sharp corners. The largest crack-free square size for a 1.5 μm thick GaN film is 500 × 500 μm2.

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Keywords

GaN, gallium nitride, MOVPE, Raman analysis, stress distribution, patterned silicon

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Citation

Kim, I, Holmi, J, Raju, R, Haapalinna, A & Suihkonen, S 2020, ' MOVPE growth of GaN on patterned 6-inch Si wafer ', Journal of Physics Communications, vol. 4, no. 4, 045010, pp. 1-10 . https://doi.org/10.1088/2399-6528/ab885c