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The effect of temperature cycling dwell times on failure mechanisms and lifetimes of Sn-Ag-Cu solder joints

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dc.contributor Aalto-yliopisto fi
dc.contributor Aalto University en
dc.contributor.advisor Mattila, Toni
dc.contributor.author Ratia, Otso
dc.date.accessioned 2020-12-23T13:18:23Z
dc.date.available 2020-12-23T13:18:23Z
dc.date.issued 2010
dc.identifier.uri https://aaltodoc.aalto.fi/handle/123456789/99132
dc.format.extent vi + 135
dc.language.iso fi en
dc.title The effect of temperature cycling dwell times on failure mechanisms and lifetimes of Sn-Ag-Cu solder joints en
dc.title Lämpösyklaustestin pitoaikojen vaikutus Sn-Ag-Cu-juoteliitosten vauriomekanismeihin ja elinikään fi
dc.contributor.school Kemian tekniikan korkeakoulu fi
dc.contributor.school School of Chemical Engineering en
dc.contributor.department Kemian ja materiaalitieteiden tiedekunta fi
dc.subject.keyword thermal cycling en
dc.subject.keyword lämpösyklaus fi
dc.subject.keyword failure mechanism en
dc.subject.keyword vauriomekanismi fi
dc.subject.keyword dwell time en
dc.subject.keyword pitoaika fi
dc.identifier.urn URN:NBN:fi:aalto-2020122357959
dc.programme.major Elektroniikan valmistustekniikka fi
dc.programme.mcode S-113 fi
dc.type.ontasot Master's thesis en
dc.type.ontasot Pro gradu -tutkielma fi
dc.contributor.supervisor Paulasto-Kröckel, Mervi
local.aalto.openaccess no
local.aalto.digifolder Aalto_04600
dc.rights.accesslevel closedAccess
local.aalto.idinssi 47435
dc.type.publication masterThesis
dc.type.okm G2 Pro gradu, diplomityö
local.aalto.digiauth ask


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