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|---|---|
| The effect of temperature cycling dwell times on failure mechanisms and lifetimes of Sn-Ag-Cu solder joints | 30 |
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| November 2021 | December 2021 | January 2022 | February 2022 | March 2022 | April 2022 | May 2022 | |
|---|---|---|---|---|---|---|---|
| The effect of temperature cycling dwell times on failure mechanisms and lifetimes of Sn-Ag-Cu solder joints | 2 | 4 | 1 | 0 | 0 | 1 | 7 |
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| China | 5 |
| United Kingdom | 4 |
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| Oakland | 6 |
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| Helsinki | 3 |
| Nanning | 2 |
| Cambridge | 1 |
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| Zhengzhou | 1 |
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