The effect of temperature cycling dwell times on failure mechanisms and lifetimes of Sn-Ag-Cu solder joints



Title:	The effect of temperature cycling dwell times on failure mechanisms and lifetimes of Sn-Ag-Cu solder joints Lämpösyklaustestin pitoaikojen vaikutus Sn-Ag-Cu-juoteliitosten vauriomekanismeihin ja elinikään
Author(s):	Ratia, Otso
Date:	2010
Language:	fi
Pages:	vi + 135
Department:	Kemian ja materiaalitieteiden tiedekunta
Major/Subject:	Elektroniikan valmistustekniikka
Supervising professor(s):	Paulasto-Kröckel, Mervi
Thesis advisor(s):	Mattila, Toni
Keywords:	thermal cycling, lämpösyklaus, failure mechanism, vauriomekanismi, dwell time, pitoaika
Location:	Archive
	OEVS yes
Digitized thesis:	ask
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Permanent link to this item: http://urn.fi/URN:NBN:fi:aalto-2020122357959 Email this Export to RefWorks QR Code Print BibTex Tweet