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The effect of temperature cycling dwell times on failure mechanisms and lifetimes of Sn-Ag-Cu solder joints
Title:
The effect of temperature cycling dwell times on failure mechanisms and lifetimes of Sn-Ag-Cu solder joints Lämpösyklaustestin pitoaikojen vaikutus Sn-Ag-Cu-juoteliitosten vauriomekanismeihin ja elinikään