Optimization of a componentboard's reflow-process
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Journal Title
Journal ISSN
Volume Title
Helsinki University of Technology |
Diplomityö
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Instructions for the author
Instructions for the author
Author
Date
2000
Department
Major/Subject
Elektroniikan valmistustekniikka
Mcode
S-113
Degree programme
Language
fi
Pages
99 s. + liitt. 15
Series
Description
Supervisor
Kivilahti, JormaThesis advisor
Vuorinen, VesaKeywords
juotosprosessi, lämmönsiirtyminen, juotosprofiili, komponenttilevy, juotepasta, juoksute, soldering process, heat transfer, soldering profile, component board, solder paste, flux
