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Mechanical and thermomechanical properties of solder joints in cellular phone environment

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dc.contributor Aalto-yliopisto fi
dc.contributor Aalto University en
dc.contributor.advisor Forstén, Atso
dc.contributor.author Laitinen, Janne
dc.date.accessioned 2020-12-03T20:56:22Z
dc.date.available 2020-12-03T20:56:22Z
dc.date.issued 1997
dc.identifier.uri https://aaltodoc.aalto.fi/handle/123456789/85421
dc.format.extent 108
dc.language.iso en en
dc.title Mechanical and thermomechanical properties of solder joints in cellular phone environment en
dc.title Juoteliitosten mekaaniset ja termomekaaniset ominaisuudet matkapuhelinympäristössä fi
dc.contributor.school Teknillinen korkeakoulu fi
dc.contributor.school Helsinki University of Technology en
dc.contributor.department Materiaali- ja kalliotekniikan osasto fi
dc.identifier.urn URN:NBN:fi:aalto-2020120344259
dc.programme.major Elektroniikan materiaali- ja valmistustekniikka fi
dc.programme.mcode Mak-113 fi
dc.type.ontasot Master's thesis en
dc.type.ontasot Pro gradu -tutkielma fi
dc.contributor.supervisor Kivilahti, Jorma
local.aalto.openaccess no
local.aalto.digifolder Aalto_40622
dc.rights.accesslevel closedAccess
local.aalto.idinssi 12677
dc.type.publication masterThesis
dc.type.okm G2 Pro gradu, diplomityö
local.aalto.digiauth ask


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