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Printed circuit board level thermal modelling of an electronic device

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dc.contributor Aalto-yliopisto fi
dc.contributor Aalto University en
dc.contributor.advisor Kivilahti, Jorma
dc.contributor.author Lybeck, Emma
dc.date.accessioned 2020-12-03T20:56:19Z
dc.date.available 2020-12-03T20:56:19Z
dc.date.issued 1997
dc.identifier.uri https://aaltodoc.aalto.fi/handle/123456789/85420
dc.format.extent 69
dc.language.iso fi en
dc.title Printed circuit board level thermal modelling of an electronic device en
dc.title Elektroniikkatuotteen piirilevytason terminen mallinnus fi
dc.contributor.school Teknillinen korkeakoulu fi
dc.contributor.school Helsinki University of Technology en
dc.contributor.department Materiaali- ja kalliotekniikan osasto fi
dc.subject.keyword thermal design en
dc.subject.keyword lämpömallinnus fi
dc.subject.keyword thermal modelling en
dc.subject.keyword lämpösuunnittelu fi
dc.subject.keyword Flotherm en
dc.subject.keyword Flotherm fi
dc.identifier.urn URN:NBN:fi:aalto-2020120344258
dc.programme.major Elektroniikan materiaali- ja valmistustekniikka fi
dc.programme.mcode Mak-113 fi
dc.type.ontasot Master's thesis en
dc.type.ontasot Pro gradu -tutkielma fi
dc.contributor.supervisor Kivilahti, Jorma
local.aalto.openaccess no
local.aalto.digifolder Aalto_43228
dc.rights.accesslevel closedAccess
local.aalto.idinssi 12676
dc.type.publication masterThesis
dc.type.okm G2 Pro gradu, diplomityö
local.aalto.digiauth ask


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