Computational models for microvia fill process control

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dc.contributor Aalto-yliopisto fi
dc.contributor Aalto University en
dc.contributor.advisor Tenno, Robert, Prof.
dc.contributor.author Pohjoranta, Antti
dc.date.accessioned 2012-08-24T07:49:25Z
dc.date.available 2012-08-24T07:49:25Z
dc.date.issued 2010
dc.identifier.isbn 978-952-60-3064-7 (electronic)
dc.identifier.isbn 978-952-60-3063-0 (printed) #8195;
dc.identifier.uri https://aaltodoc.aalto.fi/handle/123456789/4750
dc.description.abstract The microvia fill process is an electrochemical copper deposition process applied in the manufacturing of multilayered printed circuit boards (PCBs). It is the process where the metallic interconnections between adjacent signal layers of the multilayered PCB are made. The process chemistry is complex, including the interactions of several additive chemicals in addition to the underlying basic electrochemical processes of copper electrodeposition. To this day, the microvia fill process equipment set-ups utilized in the industry have none or very little automatic online control of the process variables. This is mostly because direct online measuring of the microvia fill process is practically impossible due to the vast number of microscopic features on a PCB, as well as to the small size of the features. The electronics industry is continuously striving to produce cheaper, smaller and more complex devices for an immeasurable number of applications. In the core of every electronics-appliance there is a PCB, which forms the chassis for the electronic components of the device as well as the signal paths between the components. Considering the enormous size of the electronics industry, as well as the ubiquitous nature of electronics, it is clear why PCB manufacturers consider that improving the microvia fill process technology is a relevant object for development. This doctoral thesis presents novel means for improving the microvia fill process through process simulation and model-based process design. The main results of the thesis are distributed parameter models, which together form the main components necessary for modeling a practical microvia fill electrolysis apparatus and designing a model-based control system for the process. Though the models are primarily based on physical and chemical first principles, the development work of all models presented in this thesis relies on experimental data that is gathered to parameterize and to validate the models. The thesis consists of a summary and nine publications, which address the modeling of the microvia fill process, the computational methods necessary for these models and the modeling of copper electrolysis systems in general. en
dc.format.extent Verkkokirja (2818 KB, 63 s.)
dc.format.mimetype application/pdf
dc.language.iso en en
dc.publisher Aalto-yliopiston teknillinen korkeakoulu en
dc.relation.haspart [Publication 1]: A. Pohjoranta and R. Tenno. 2007. A method for microvia-fill process modeling in a Cu plating system with additives. Journal of The Electrochemical Society, volume 154, number 10, pages D502-D509. © 2007 The Electrochemical Society (ECS). By permission. en
dc.relation.haspart [Publication 2]: R. Tenno and A. Pohjoranta. 2008. An ALE model for prediction and control of the microvia fill process with two additives. Journal of The Electrochemical Society, volume 155, number 5, pages D383-D388. © 2008 The Electrochemical Society (ECS). By permission. en
dc.relation.haspart [Publication 3]: A. Pohjoranta and R. Tenno. 2009. A computational multi-reaction model of a Cu electrolysis cell. Electrochimica Acta, volume 54, number 24, pages 5949-5958. © 2009 Elsevier Science. By permission. en
dc.relation.haspart [Publication 4]: A. Pohjoranta, A. Mendelson, and R. Tenno. 2010. A copper electrolysis cell model including effects of the ohmic potential loss in the cell. Electrochimica Acta, volume 55, number 3, pages 1001-1012. © 2009 Elsevier Science. By permission. en
dc.relation.haspart [Publication 5]: R. Tenno and A. Pohjoranta. 2009. Microvia fill process control. International Journal of Control, volume 82, number 5, pages 883-893. en
dc.relation.haspart [Publication 6]: Robert Tenno and Antti Pohjoranta. 2008. Exact controls for the superconformal via fill process. In: Proceedings of the UKACC International Conference on Control 2008. Manchester, UK. 2-4 September 2008. 6 pages. © 2008 The Institution of Engineering and Technology (IET). By permission. en
dc.relation.haspart [Publication 7]: A. Pohjoranta and R. Tenno. Implementing surfactant mass balance in 2D FEM-ALE models. Engineering with Computers, 12 pages, accepted for publication 13 February 2010. en
dc.relation.haspart [Publication 8]: A. Pohjoranta and R. Tenno. 2007. Modelling of surfactant mass balance for microvia fill monitoring. In: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP 2007). Shanghai, China. 26-28 June 2007. Pages 198-201. ISBN 1-4244-1253-6. © 2007 Institute of Electrical and Electronics Engineers (IEEE). By permission. en
dc.relation.haspart [Publication 9]: Robert Tenno and Antti Pohjoranta. 2007. Microvia fill ratio control. In: Proceedings of the 2007 IEEE International Symposium on Industrial Electronics (ISIE 2007). Vigo, Spain. 4-7 June 2007. Pages 153-156. ISBN 1-4244-0755-9. © 2007 Institute of Electrical and Electronics Engineers (IEEE). By permission. en
dc.subject.other Materials science
dc.subject.other Automation
dc.subject.other Chemistry
dc.title Computational models for microvia fill process control en
dc.type G5 Artikkeliväitöskirja fi
dc.contributor.school Aalto-yliopiston teknillinen korkeakoulu fi
dc.contributor.department Automaatio- ja systeemitekniikan laitos fi
dc.contributor.department Department of Automation and Systems Technology en
dc.subject.keyword microvia fill modeling en
dc.subject.keyword copper electroplating en
dc.subject.keyword electroplating modeling en
dc.subject.keyword ALE method en
dc.identifier.urn URN:ISBN:978-952-60-3064-7
dc.type.dcmitype text en
dc.type.ontasot Väitöskirja (artikkeli) fi
dc.type.ontasot Doctoral dissertation (article-based) en
dc.contributor.supervisor Koivo, Heikki, Prof.


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