Mechanical properties and reliability of aluminum nitride thin films

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dc.contributor Aalto-yliopisto fi
dc.contributor Aalto University en Österlund, Elmeri Kinnunen, Jere Rontu, Ville Torkkeli, Altti Paulasto-Kröckel, Mervi 2018-10-24T09:39:10Z 2018-10-24T09:39:10Z 2019-01-25
dc.identifier.citation Österlund , E , Kinnunen , J , Rontu , V , Torkkeli , A & Paulasto-Kröckel , M 2019 , ' Mechanical properties and reliability of aluminum nitride thin films ' JOURNAL OF ALLOYS AND COMPOUNDS , vol 772 , pp. 306-313 . DOI: 10.1016/j.jallcom.2018.09.062 en
dc.identifier.issn 0925-8388
dc.identifier.other PURE UUID: 0f109168-ba52-4f29-af33-d11251beea0e
dc.identifier.other PURE ITEMURL:
dc.identifier.other PURE LINK:
dc.description.abstract Knowledge of the mechanical properties and fatigue behavior of thin films is important for the design and reliability of microfabricated devices. This study uses the bulge test to measure the residual stress, Young's modulus, and fracture strength of aluminum nitride (AlN) thin films with different micro-structures prepared by sputtering, metalorganic vapor phase epitaxy (MOVPE), and atomic layer deposition (ALD). In addition, the fatigue behavior is studied under cyclic loading. The results indicate that the fracture strength and Young's modulus of AlN are mainly determined by the film microstructure, which is consecutively influenced by the deposition method and conditions. A microstructure with a higher order of crystallinity has increased fracture strength and Young's modulus. Additionally, the strength limiting defects are located at the film-substrate interface. The measured residual stresses were 249, 876, 1,526, and 272 MPa for two sputtered films of different thicknesses, MOVPE and ALD films, respectively. The fracture strengths were 1.42, 1.54, 2.76, and 0.61 GPa, and Young's moduli were 335, 343, 346, and 272 GPa. No clear signs of fatigue were observed after 10,000 cycles at a load corresponding to 83% of the fracture strength. (C) 2018 Elsevier B.V. All rights reserved. en
dc.format.extent 8
dc.format.extent 306-313
dc.language.iso en en
dc.relation.ispartofseries JOURNAL OF ALLOYS AND COMPOUNDS en
dc.relation.ispartofseries Volume 772 en
dc.rights embargoedAccess en
dc.subject.other Mechanics of Materials en
dc.subject.other Mechanical Engineering en
dc.subject.other Metals and Alloys en
dc.subject.other Materials Chemistry en
dc.subject.other 214 Mechanical engineering en
dc.subject.other 216 Materials engineering en
dc.title Mechanical properties and reliability of aluminum nitride thin films en
dc.type A1 Alkuperäisartikkeli tieteellisessä aikakauslehdessä fi
dc.description.version Peer reviewed en
dc.contributor.department Department of Electrical Engineering and Automation
dc.contributor.department Aalto University
dc.contributor.department Department of Chemistry and Materials Science
dc.contributor.department Murata Electronics Oy
dc.subject.keyword mechanical properties
dc.subject.keyword Nitride materials
dc.subject.keyword Thin films
dc.subject.keyword Microstructure
dc.subject.keyword Mechanical properties
dc.subject.keyword SINGLE
dc.subject.keyword ELASTIC PROPERTIES
dc.subject.keyword HIGH-TEMPERATURE
dc.subject.keyword SILICON
dc.subject.keyword FRACTURE STRENGTH
dc.subject.keyword ALN BUFFER
dc.subject.keyword CRYSTAL PLASTICITY
dc.subject.keyword MEMS
dc.subject.keyword STRESS
dc.subject.keyword ATOMIC LAYER DEPOSITION
dc.subject.keyword Mechanics of Materials
dc.subject.keyword Mechanical Engineering
dc.subject.keyword Metals and Alloys
dc.subject.keyword Materials Chemistry
dc.subject.keyword 214 Mechanical engineering
dc.subject.keyword 216 Materials engineering
dc.identifier.urn URN:NBN:fi:aalto-201810245511
dc.identifier.doi 10.1016/j.jallcom.2018.09.062 info:eu-repo/date/embargoEnd/2020-09-15

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