Test structure design and verification of Cu-Sn bonds manufactured by transient-liquid phase bonding

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Journal Title
Journal ISSN
Volume Title
Sähkötekniikan korkeakoulu | Master's thesis
Date
2018-10-08
Department
Major/Subject
Micro- and Nanosciences
Mcode
ELEC3037
Degree programme
NanoRad - Master’s Programme in Nano and Radio Sciences (TS2013)
Language
en
Pages
56+7
Series
Description
Supervisor
Vuorinen, Vesa
Thesis advisor
Ross, Glenn
Keywords
MEMS, reliability, TLP, bonding
Other note
Citation