Comparison of mechanical properties and composition of magnetron sputter and plasma enhanced atomic layer deposition aluminum nitride films

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dc.contributor Aalto-yliopisto fi
dc.contributor Aalto University en
dc.contributor.author Sippola, Perttu
dc.contributor.author Pyymaki Perros, Alexander
dc.contributor.author Ylivaara, Oili M.E.
dc.contributor.author Ronkainen, Helena
dc.contributor.author Julin, Jaakko
dc.contributor.author Liu, Xuwen
dc.contributor.author Sajavaara, Timo
dc.contributor.author Etula, Jarkko
dc.contributor.author Lipsanen, Harri
dc.contributor.author Puurunen, Riikka L.
dc.date.accessioned 2018-08-21T13:44:55Z
dc.date.available 2018-08-21T13:44:55Z
dc.date.issued 2018-09-01
dc.identifier.citation Sippola , P , Pyymaki Perros , A , Ylivaara , O M E , Ronkainen , H , Julin , J , Liu , X , Sajavaara , T , Etula , J , Lipsanen , H & Puurunen , R L 2018 , ' Comparison of mechanical properties and composition of magnetron sputter and plasma enhanced atomic layer deposition aluminum nitride films ' Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films , vol 36 , no. 5 , 051508 . DOI: 10.1116/1.5038856 en
dc.identifier.issn 0734-2101
dc.identifier.issn 1520-8559
dc.identifier.other PURE UUID: 63bd9daf-8b41-4319-a8bf-2441ccda1a4b
dc.identifier.other PURE ITEMURL: https://research.aalto.fi/en/publications/comparison-of-mechanical-properties-and-composition-of-magnetron-sputter-and-plasma-enhanced-atomic-layer-deposition-aluminum-nitride-films(63bd9daf-8b41-4319-a8bf-2441ccda1a4b).html
dc.identifier.other PURE LINK: http://www.scopus.com/inward/record.url?scp=85050998462&partnerID=8YFLogxK
dc.identifier.uri https://aaltodoc.aalto.fi/handle/123456789/33502
dc.description.abstract A comparative study of mechanical properties and elemental and structural composition was made for aluminum nitride thin films deposited with reactive magnetron sputtering and plasma enhanced atomic layer deposition (PEALD). The sputtered films were deposited on Si (100), Mo (110), and Al (111) oriented substrates to study the effect of substrate texture on film properties. For the PEALD trimethylaluminum-ammonia films, the effects of process parameters, such as temperature, bias voltage, and plasma gas (ammonia versus N2/H2), on the AlN properties were studied. All the AlN films had a nominal thickness of 100 nm. Time-of-flight elastic recoil detection analysis showed the sputtered films to have lower impurity concentration with an Al/N ratio of 0.95, while the Al/N ratio for the PEALD films was 0.81-0.90. The mass densities were ∼3.10 and ∼2.70 g/cm3 for sputtered and PEALD AlN, respectively. The sputtered films were found to have higher degrees of preferential crystallinity, whereas the PEALD films were more polycrystalline as determined by x-ray diffraction. Nanoindentation experiments showed the elastic modulus and hardness to be 250 and 22 GPa, respectively, for sputtered AlN on the (110) substrate, whereas with PEALD AlN, values of 180 and 19 GPa, respectively, were obtained. The sputtered films were under tensile residual stress (61-421 MPa), whereas the PEALD films had a residual stress ranging from tensile to compressive (846 to −47 MPa), and high plasma bias resulted in compressive films. The adhesion of both films was good on Si, although sputtered films showed more inconsistent critical load behavior. Also, the substrate underneath the sputtered AlN did not withstand high wear forces as with the PEALD AlN. The coefficient of friction was determined to be ∼0.2 for both AlN types, and their wear characteristics were almost identical. en
dc.language.iso en en
dc.relation.ispartofseries Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films en
dc.relation.ispartofseries Volume 36, issue 5 en
dc.rights embargoedAccess en
dc.subject.other Condensed Matter Physics en
dc.subject.other Surfaces and Interfaces en
dc.subject.other Surfaces, Coatings and Films en
dc.subject.other 114 Physical sciences en
dc.subject.other 216 Materials engineering en
dc.title Comparison of mechanical properties and composition of magnetron sputter and plasma enhanced atomic layer deposition aluminum nitride films en
dc.type A1 Alkuperäisartikkeli tieteellisessä aikakauslehdessä fi
dc.description.version Peer reviewed en
dc.contributor.department Department of Electronics and Nanoengineering
dc.contributor.department School common, ELEC
dc.contributor.department VTT Technical Research Centre of Finland
dc.contributor.department University of Jyväskylä
dc.contributor.department School services, CHEM
dc.contributor.department Department of Chemistry and Materials Science
dc.contributor.department Department of Chemical and Metallurgical Engineering
dc.subject.keyword Condensed Matter Physics
dc.subject.keyword Surfaces and Interfaces
dc.subject.keyword Surfaces, Coatings and Films
dc.subject.keyword 114 Physical sciences
dc.subject.keyword 216 Materials engineering
dc.identifier.urn URN:NBN:fi:aalto-201808214635
dc.identifier.doi 10.1116/1.5038856
dc.date.embargo info:eu-repo/date/embargoEnd/2019-07-31


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