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Flip-chip packaging for millimeter-wave integrated circuits

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dc.contributor Aalto-yliopisto fi
dc.contributor Aalto University en
dc.contributor.advisor Vähä-heikkilä, Tauno
dc.contributor.author Forstén, Henrik
dc.date.accessioned 2016-12-22T11:11:45Z
dc.date.available 2016-12-22T11:11:45Z
dc.date.issued 2016-12-12
dc.identifier.uri https://aaltodoc.aalto.fi/handle/123456789/23948
dc.format.extent 57+6
dc.language.iso en en
dc.title Flip-chip packaging for millimeter-wave integrated circuits en
dc.title Kääntöliitospaketointi millimetriaaltoalueen integroiduille piireille fi
dc.type G2 Pro gradu, diplomityö fi
dc.contributor.school Sähkötekniikan korkeakoulu fi
dc.subject.keyword flip-chip en
dc.subject.keyword MMIC en
dc.subject.keyword interconnect en
dc.subject.keyword millimeter wave en
dc.subject.keyword integrated circuit en
dc.identifier.urn URN:NBN:fi:aalto-201612226241
dc.programme.major Mikro- ja nanoelektroniikkasuunnittelu fi
dc.programme.mcode ELEC3036 fi
dc.type.ontasot Master's thesis en
dc.type.ontasot Diplomityö fi
dc.contributor.supervisor Halonen, Kari
dc.programme NanoRad - Master’s Programme in Nano and Radio Sciences (TS2013) fi
dc.location P1 fi
local.aalto.openaccess no
dc.rights.accesslevel closedAccess
local.aalto.idinssi 55279
dc.type.publication masterThesis
dc.type.okm G2 Pro gradu, diplomityö


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