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Design of the Contact Metallizations for Gold-Tin Eutectic Solder-A Thermodynamic-Kinetic Analysis

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dc.contributor Aalto-yliopisto fi
dc.contributor Aalto University en
dc.contributor.advisor Vuorinen, Vesa, Dr., Aalto University, Department of Electrical Engineering and Automation, Finland
dc.contributor.author Dong, Hongqun
dc.date.accessioned 2016-09-13T09:01:29Z
dc.date.available 2016-09-13T09:01:29Z
dc.date.issued 2016
dc.identifier.isbn 978-952-60-6995-1 (electronic)
dc.identifier.isbn 978-952-60-6996-8 (printed)
dc.identifier.issn 1799-4942 (electronic)
dc.identifier.issn 1799-4934 (printed)
dc.identifier.issn 1799-4934 (ISSN-L)
dc.identifier.uri https://aaltodoc.aalto.fi/handle/123456789/21920
dc.description.abstract This dissertation focuses on the design of reliable interconnections using Au-20wt.%Sn solder with the assistance of thermodynamic calculations. In this work, three commonly encountered contact metallizations, namely Ni, Cu, and Pt, have been selected. In order to assess the reliability of the Au-20wt.%Sn|X (X=Ni, Cu and Pt) interconnections from the metallurgical viewpoint, firstly, the phase diagrams of the Au-Sn-X ternary systems have been thermodynamically established with the Calphad method. Secondly, the diffusion couple method was employed to study the interfacial reactions experimentally. The microstructures of the as-soldered and subsequently aged Au-20wt.%Sn|X interconnections were characterized by means of scanning electron microscopy equipped with energy-dispersive X-ray spectroscopy (EDX) and scanning transmission electron microscopy with EDX. The observed interfacial reaction phenomena have been rationalized by combining the experimental results with the thermodynamic considerations. Emphasis has also been placed on collecting the mechanical properties of the IMCs formed at the solder/Cu and Ni interfaces since these values are essential for evaluating the reliability of the interconnections.  The results in this dissertation show that Au-20wt.%Sn|Pt was more thermally stable than Au-20wt.%Sn|Ni and Au-20wt.%Sn|Cu when these as-soldered reaction couples were subsequently aged at 150 °C for a long-term. When a short bonding time is employed, Pt contact metallization is superior to the Ni and Cu contact metallizations for the Au-20wt.%Sn solder. en
dc.format.extent pp. 59 + app. 73
dc.format.mimetype application/pdf en
dc.language.iso en en
dc.publisher Aalto University en
dc.publisher Aalto-yliopisto fi
dc.relation.ispartofseries Aalto University publication series DOCTORAL DISSERTATIONS en
dc.relation.ispartofseries 176/2016
dc.relation.haspart [Publication 1]: Dong Hongqun, Vuorinen Vesa, Laurila Tomi, Paulasto-Kröckel Mervi. 2013. Thermodynamic reassessment of Au–Ni–Sn ternary system. Elsevier, Calphad, 43, 61-70. ISSN: 0364-5916. DOI:10.1016/j.calphad.2013.10.001
dc.relation.haspart [Publication 2]: Dong Hongqun, Vuorinen Vesa, Tao Xiaoma, Laurila Tomi, Paulasto- Kröckel Mervi. 2014. Thermodynamic reassessment of Au-Cu-Sn ternary system. Elsevier. Journal of Alloys and Compounds, 588 (5), 449-460. ISSN:0925-8388. DOI: 10.1016/j.jallcom.2013.11.041
dc.relation.haspart [Publication 3]: Dong Hongqun, Vuorinen Vesa, Liu Xuwen, Laurila Tomi, Li Jue, Paulasto- Kröckel Mervi. 2016. Microstructural Evolution and Mechanical Properties of Au-20wt.% Sn| Ni Interconnection. Springer. Journal of Electronic Materials, 45(1), 566-575. ISSN: 0361-5235. DOI: 10.1007/s11664-015-4152-3
dc.relation.haspart [Publication 4]: Dong Hongqun, Vuorinen Vesa, Laurila Tomi, Paulasto-Kröckel Mervi. 2016. Microstructural Evolution and Mechanical Properties in (AuSn)eut-Cu interconnections. Springer. Journal of Electronic Materials, 45(10), 5478–5486. ISSN: 0361- 5235. DOI: 10.1007/s11664-016-4733-9
dc.relation.haspart [Publication 5]: Dong Hongqun, Vuorinen Vesa, Broas Mikael, Paulasto-Kröckel Mervi. 2016. Thermodynamic Reassessment of the Au-Pt-Sn System and Microstructural evolution of the (AuSn)eut-Pt Interconnection. Journal of Alloys and Compounds, 688, 388-398. ISSN: 0925-8388. DOI: 10.1016/j.jallcom.2016.07.129
dc.subject.other Chemistry en
dc.subject.other Metallurgy en
dc.subject.other Electrical engineering en
dc.subject.other Materials science en
dc.title Design of the Contact Metallizations for Gold-Tin Eutectic Solder-A Thermodynamic-Kinetic Analysis en
dc.type G5 Artikkeliväitöskirja fi
dc.contributor.school Sähkötekniikan korkeakoulu fi
dc.contributor.school School of Electrical Engineering en
dc.contributor.department Sähkötekniikan ja automaation laitos fi
dc.contributor.department Department of Electrical Engineering and Automation en
dc.subject.keyword contact metallization (Ni, Cu, Pt) en
dc.subject.keyword Au-20wt.%Sn solder en
dc.subject.keyword Calphad en
dc.subject.keyword microstructural characterization en
dc.subject.keyword interfacial reaction en
dc.subject.keyword mechanical properties en
dc.identifier.urn URN:ISBN:978-952-60-6995-1
dc.type.dcmitype text en
dc.type.ontasot Doctoral dissertation (article-based) en
dc.type.ontasot Väitöskirja (artikkeli) fi
dc.contributor.supervisor Paulasto-Kröckel, Mervi, Associate Prof., Aalto University, Department of Electrical Engineering and Automation, Finland
dc.opn Kroupa, Aleš. Prof., Institute of Physics of Materials, Academy of Science of the Czech Republic, Czech Republic
dc.opn Jantunen, Heli, Prof., University of Oulu, Finland
dc.contributor.lab Electronics Production Technology en
dc.rev Kroupa, Aleš. Prof., Institute of Physics of Materials, Academy of Science of the Czech Republic, Czech Republic
dc.rev Kao, Robert C., Prof., National Taiwan University, Taiwan
dc.date.defence 2016-09-30
local.aalto.formfolder 2016_09_12_klo_13_31
local.aalto.archive yes


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